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首页 > Products >Integrated Circuits (ICs) >Embedded - System On Chip (SoC) >XCZU6EG-L1FFVC900I > XCZU6EG-L1FFVC900I Compare > XCZU6EG-L1FFVC900I DW-03-20-T-D-850 DW-05-13-L-S-875 Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCZU6EG-L1FFVC900I.PDF,
XCZU6EG-L1FFVC900I.docx,
XCZU6EG-L1FFVC900I.zip)

XCZU6EG-L1FFVC900I

XCZU6EG-L1FFVC900I 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DW-05-13-L-S-875.PDF,
DW-05-13-L-S-875.docx,
DW-05-13-L-S-875.zip)

DW-05-13-L-S-875

DW-05-13-L-S-875 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DW-03-20-T-D-850.PDF,
DW-03-20-T-D-850.docx,
DW-03-20-T-D-850.zip)

DW-03-20-T-D-850

DW-03-20-T-D-850 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
XCZU6EG-L1FFVC900I XCZU6EG-L1FFVC900I

(Alternative models available)

 Xilinx Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCZU6EG-L1FFVC900I.PDF,
XCZU6EG-L1FFVC900I.docx,
XCZU6EG-L1FFVC900I.zip)

1+: $2729

10+: $2701.71

100+: $2674.42

500+: $2647.13

1000+: $2619.84

 Hybrid, electric & powertrain systems
Medical

Products:集成电路（IC）--嵌入式 - 片上系统（SoC）

Manufacturers: Xilinx.
omoelec is one of the Distributors.
Wide range of applications.

Tray 791 In Stock Zynq® UltraScale+™ MPSoC EG Active - - - - - - - - -40°C ~ 100°C (TJ) - - - - - - - Compare
DW-05-13-L-S-875 DW-05-13-L-S-875

(Alternative models available)

 Samtec, Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DW-05-13-L-S-875.PDF,
DW-05-13-L-S-875.docx,
DW-05-13-L-S-875.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Datacom module
Industrial transport (non-car & non-light truck)
PC & notebooks

Products:连接器，互连器件--矩形连接器 - 板间隔柱，堆叠器（板对板）

Manufacturers: Samtec, Inc..
omoelec is one of the Distributors.
Wide range of applications.

4931 In Stock Flex Stack, DW Active - - - - - - - - - Through Hole - - - - - - Compare
DW-03-20-T-D-850 DW-03-20-T-D-850

(Alternative models available)

 Samtec, Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DW-03-20-T-D-850.PDF,
DW-03-20-T-D-850.docx,
DW-03-20-T-D-850.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Advanced driver assistance systems (ADAS)
Grid infrastructure
Portable electronics

Products:连接器，互连器件--矩形连接器 - 板间隔柱，堆叠器（板对板）

Manufacturers: Samtec, Inc..
omoelec is one of the Distributors.
Wide range of applications.

1242 In Stock Flex Stack, DW Active - - - - - - - - - Through Hole - - - - - - Compare
  • XCZU6EG-L1FFVC900I
  • DW-05-13-L-S-875
  • DW-03-20-T-D-850