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首页 > Products >Integrated Circuits (ICs) >Embedded - System On Chip (SoC) >XCZU4EV-L2FBVB900E > XCZU4EV-L2FBVB900E Compare > XCZU4EV-L2FBVB900E LELBXB1-1REC4-52-35.0-A2-M3-V 219-3-32755-3 Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCZU4EV-L2FBVB900E.PDF,
XCZU4EV-L2FBVB900E.docx,
XCZU4EV-L2FBVB900E.zip)

XCZU4EV-L2FBVB900E

XCZU4EV-L2FBVB900E 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(219-3-32755-3.PDF,
219-3-32755-3.docx,
219-3-32755-3.zip)

219-3-32755-3

219-3-32755-3 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(LELBXB1-1REC4-52-35.0-A2-M3-V.PDF,
LELBXB1-1REC4-52-35.0-A2-M3-V.docx,
LELBXB1-1REC4-52-35.0-A2-M3-V.zip)

LELBXB1-1REC4-52-35.0-A2-M3-V

LELBXB1-1REC4-52-35.0-A2-M3-V 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
XCZU4EV-L2FBVB900E XCZU4EV-L2FBVB900E

(Alternative models available)

 Xilinx Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCZU4EV-L2FBVB900E.PDF,
XCZU4EV-L2FBVB900E.docx,
XCZU4EV-L2FBVB900E.zip)

1+: $2034

10+: $2013.66

100+: $1993.32

500+: $1972.98

1000+: $1952.64

 Datacom module
Power delivery
PC & notebooks

Products:集成电路（IC）--嵌入式 - 片上系统（SoC）

Manufacturers: Xilinx.
omoelec is one of the Distributors.
Wide range of applications.

Tray 5496 In Stock Zynq® UltraScale+™ MPSoC EV Active - - - - - - - - 0°C ~ 100°C (TJ) - - - - - - - Compare
219-3-32755-3 219-3-32755-3

(Alternative models available)

 Sensata Technologies – Airpax Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(219-3-32755-3.PDF,
219-3-32755-3.docx,
219-3-32755-3.zip)

1+: $189

10+: $187.11

100+: $185.22

500+: $183.33

1000+: $181.44

 Data storage

Products:电路保护--断路器

Manufacturers: Sensata Technologies – Airpax.
omoelec is one of the Distributors.
Wide range of applications.

1062 In Stock - Active - - - - - - - - - - - - - - - - Compare
LELBXB1-1REC4-52-35.0-A2-M3-V LELBXB1-1REC4-52-35.0-A2-M3-V

(Alternative models available)

 Sensata Technologies – Airpax Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(LELBXB1-1REC4-52-35.0-A2-M3-V.PDF,
LELBXB1-1REC4-52-35.0-A2-M3-V.docx,
LELBXB1-1REC4-52-35.0-A2-M3-V.zip)

1+: $66

10+: $65.34

100+: $64.68

500+: $64.02

1000+: $63.36

 Building automation
Lighting
Connected peripherals & printers

Products:电路保护--断路器

Manufacturers: Sensata Technologies – Airpax.
omoelec is one of the Distributors.
Wide range of applications.

7993 In Stock LEL Active - - - - - - - - - Panel Mount - - - - - - Compare
  • XCZU4EV-L2FBVB900E
  • 219-3-32755-3
  • LELBXB1-1REC4-52-35.0-A2-M3-V