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首页 > Products >Integrated Circuits (ICs) >Embedded - System On Chip (SoC) >XCZU4EG-L1FBVB900I > XCZU4EG-L1FBVB900I Compare > XCZU4EG-L1FBVB900I TW-06-02-T-D-200-089 TW-16-04-G-S-420-065 Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCZU4EG-L1FBVB900I.PDF,
XCZU4EG-L1FBVB900I.docx,
XCZU4EG-L1FBVB900I.zip)

XCZU4EG-L1FBVB900I

XCZU4EG-L1FBVB900I 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TW-16-04-G-S-420-065.PDF,
TW-16-04-G-S-420-065.docx,
TW-16-04-G-S-420-065.zip)

TW-16-04-G-S-420-065

TW-16-04-G-S-420-065 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TW-06-02-T-D-200-089.PDF,
TW-06-02-T-D-200-089.docx,
TW-06-02-T-D-200-089.zip)

TW-06-02-T-D-200-089

TW-06-02-T-D-200-089 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
XCZU4EG-L1FBVB900I XCZU4EG-L1FBVB900I

(Alternative models available)

 Xilinx Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCZU4EG-L1FBVB900I.PDF,
XCZU4EG-L1FBVB900I.docx,
XCZU4EG-L1FBVB900I.zip)

1+: $1683

10+: $1666.17

100+: $1649.34

500+: $1632.51

1000+: $1615.68

 Hybrid, electric & powertrain systems
Test & measurement
Data center & enterprise computing

Products:集成电路（IC）--嵌入式 - 片上系统（SoC）

Manufacturers: Xilinx.
omoelec is one of the Distributors.
Wide range of applications.

Tray 2087 In Stock Zynq® UltraScale+™ MPSoC EG Active - - - - - - - - -40°C ~ 100°C (TJ) - - - - - - - Compare
TW-16-04-G-S-420-065 TW-16-04-G-S-420-065

(Alternative models available)

 Samtec, Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TW-16-04-G-S-420-065.PDF,
TW-16-04-G-S-420-065.docx,
TW-16-04-G-S-420-065.zip)

1+: $3

10+: $2.97

100+: $2.94

500+: $2.91

1000+: $2.88

 Wireless infrastructure
Test & measurement

Products:连接器，互连器件--矩形连接器 - 板间隔柱，堆叠器（板对板）

Manufacturers: Samtec, Inc..
omoelec is one of the Distributors.
Wide range of applications.

3498 In Stock TW Active - - - - - - - - - Through Hole - - - - - - Compare
TW-06-02-T-D-200-089 TW-06-02-T-D-200-089

(Alternative models available)

 Samtec, Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TW-06-02-T-D-200-089.PDF,
TW-06-02-T-D-200-089.docx,
TW-06-02-T-D-200-089.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Grid infrastructure

Products:连接器，互连器件--矩形连接器 - 板间隔柱，堆叠器（板对板）

Manufacturers: Samtec, Inc..
omoelec is one of the Distributors.
Wide range of applications.

8074 In Stock TW Active - - - - - - - - - Through Hole - - - - - - Compare
  • XCZU4EG-L1FBVB900I
  • TW-16-04-G-S-420-065
  • TW-06-02-T-D-200-089