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首页 > Products >Integrated Circuits (ICs) >Embedded - FPGAs (Field Programmable Gate Array) >XCV400-5BG560C > XCV400-5BG560C Compare > XCV400-5BG560C FXP29.07.0070A A09-HSM-7 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCV400-5BG560C.PDF,
XCV400-5BG560C.docx,
XCV400-5BG560C.zip)

XCV400-5BG560C

XCV400-5BG560C 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(A09-HSM-7.PDF,
A09-HSM-7.docx,
A09-HSM-7.zip)

A09-HSM-7

A09-HSM-7 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FXP29.07.0070A.PDF,
FXP29.07.0070A.docx,
FXP29.07.0070A.zip)

FXP29.07.0070A

FXP29.07.0070A 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
XCV400-5BG560C XCV400-5BG560C

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XCV400-5BG560C.PDF,
XCV400-5BG560C.docx,
XCV400-5BG560C.zip)

1+: $499

10+: $494.01

100+: $489.02

500+: $484.03

1000+: $479.04

 Appliances
TV

Products:集成电路（IC）--嵌入式 - FPGA（现场可编程门阵列）

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

3682 In Stock * Active - - - - - - - - - - - - - - - - Compare
A09-HSM-7 A09-HSM-7

(Alternative models available)

 Digi Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(A09-HSM-7.PDF,
A09-HSM-7.docx,
A09-HSM-7.zip)

1+: $20

10+: $19.8

100+: $19.6

500+: $19.4

1000+: $19.2

 Infotainment & cluster
Lighting
Gaming

Products:射频和无线--RF 天线

Manufacturers: Digi.
omoelec is one of the Distributors.
Wide range of applications.

177 In Stock - Active - - - - - - - - - Connector Mount - - - - - - Compare
FXP29.07.0070A FXP29.07.0070A

(Alternative models available)

 Taoglas Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FXP29.07.0070A.PDF,
FXP29.07.0070A.docx,
FXP29.07.0070A.zip)

1+: $11

10+: $10.89

100+: $10.78

500+: $10.67

1000+: $10.56

 Test & measurement

Products:射频和无线--RF 天线

Manufacturers: Taoglas.
omoelec is one of the Distributors.
Wide range of applications.

1649 In Stock - Active - - - - - - - - - Adhesive - - - - - - Compare
  • XCV400-5BG560C
  • A09-HSM-7
  • FXP29.07.0070A