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首页 > Products >Integrated Circuits (ICs) >Interface - Controllers >TSB13LV11GGB > TSB13LV11GGB Compare > TSB13LV11GGB CM9746-000 HEX40-AC-90-23-A10-1DS Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TSB13LV11GGB.PDF,
TSB13LV11GGB.docx,
TSB13LV11GGB.zip)

TSB13LV11GGB

TSB13LV11GGB 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HEX40-AC-90-23-A10-1DS.PDF,
HEX40-AC-90-23-A10-1DS.docx,
HEX40-AC-90-23-A10-1DS.zip)

HEX40-AC-90-23-A10-1DS

HEX40-AC-90-23-A10-1DS 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CM9746-000.PDF,
CM9746-000.docx,
CM9746-000.zip)

CM9746-000

CM9746-000 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
TSB13LV11GGB TSB13LV11GGB

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TSB13LV11GGB.PDF,
TSB13LV11GGB.docx,
TSB13LV11GGB.zip)

1+: $7

10+: $6.93

100+: $6.86

500+: $6.79

1000+: $6.72

 Pro audio, video & signage
Mobile phones
Portable electronics

Products:集成电路（IC）--接口 - 控制器

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1705 In Stock * Active - - - - - - - - - - - - - - - - Compare
HEX40-AC-90-23-A10-1DS HEX40-AC-90-23-A10-1DS

(Alternative models available)

 TE Connectivity Raychem Cable Protection Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HEX40-AC-90-23-A10-1DS.PDF,
HEX40-AC-90-23-A10-1DS.docx,
HEX40-AC-90-23-A10-1DS.zip)

1+: $348

10+: $344.52

100+: $341.04

500+: $337.56

1000+: $334.08

 Infotainment & cluster
Electronic point of sale (EPOS)
Gaming

Products:连接器，互连器件--圆形连接器 - 底壳和电缆夹

Manufacturers: TE Connectivity Raychem Cable Protection.
omoelec is one of the Distributors.
Wide range of applications.

411 In Stock HexaShield Active Backshell, Heat Shrink Adapter - - - - - - - - - - - - - - - Compare
CM9746-000 CM9746-000

(Alternative models available)

 TE Connectivity Aerospace Defense and Marine Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CM9746-000.PDF,
CM9746-000.docx,
CM9746-000.zip)

1+: $100

10+: $99

100+: $98

500+: $97

1000+: $96

 Wireless infrastructure
Mobile phones

Products:连接器，互连器件--圆形连接器 - 底壳和电缆夹

Manufacturers: TE Connectivity Aerospace Defense and Marine.
omoelec is one of the Distributors.
Wide range of applications.

9202 In Stock TXR Active Backshell, Heat Shrink Adapter - - - - - - - - - - - - - - - Compare
  • TSB13LV11GGB
  • HEX40-AC-90-23-A10-1DS
  • CM9746-000