Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
T550B206M060AT4251
(Alternative models available) |
KEMET |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(T550B206M060AT4251.PDF, |
1+: $55 10+: $54.45 100+: $53.9 500+: $53.35 1000+: $52.8 |
Aerospace & defense Power delivery Enterprise machine |
Products:电容器--钽 - 聚合物电容器 |
Manufacturers: KEMET. |
3353 In Stock | T550 | Active | Hermetically Sealed | - | - | - | - | - | - | - | -55°C ~ 105°C | Through Hole | 0.281"" Dia x 0.641"" L (7.14mm x 16.28mm) | - | - | - | - | - | Compare | ||
10450.4
(Alternative models available) |
Conta-Clip |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(10450.4.PDF, |
1+: $2 10+: $1.98 100+: $1.96 500+: $1.94 1000+: $1.92 |
Datacom module |
Products:连接器,互连器件--端子块 - 线对板 |
Manufacturers: Conta-Clip. |
Box | 3615 In Stock | - | Active | - | - | - | - | - | - | - | - | - | Through Hole | - | - | - | - | - | - | Compare | |
10583.1
(Alternative models available) |
Conta-Clip |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(10583.1.PDF, |
1+: $11 10+: $10.89 100+: $10.78 500+: $10.67 1000+: $10.56 |
Electronic point of sale (EPOS) |
Products:连接器,互连器件--端子块 - 线对板 |
Manufacturers: Conta-Clip. |
Box | 3078 In Stock | - | Active | - | - | - | - | - | - | - | - | - | Through Hole | - | - | - | - | - | - | Compare |
- T550B206M060AT4251
- 10450.4
- 10583.1