Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
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S912XEG384BCAL
(Alternative models available) |
NXP Semiconductors |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(S912XEG384BCAL.PDF, |
1+: $20 10+: $19.8 100+: $19.6 500+: $19.4 1000+: $19.2 |
Wireless infrastructure Medical Portable electronics |
Products:集成电路(IC)--嵌入式 - 单片机 |
Manufacturers: NXP Semiconductors. |
Tray | 537 In Stock | HCS12X | Active | - | - | - | - | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | - | - | - | - | - | - | Compare | |
GMA.2B.040.DR
(Alternative models available) |
REDEL / LEMO |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(GMA.2B.040.DR.PDF, |
1+: $7 10+: $6.93 100+: $6.86 500+: $6.79 1000+: $6.72 |
Body electronics & lighting Medical Mobile phones |
Products:连接器,互连器件--圆形连接器 - 配件 |
Manufacturers: REDEL / LEMO. |
Box | 330 In Stock | 2B | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Strain Relief | 2B Series Connector | Compare | |
BRD.00.200.PCSN
(Alternative models available) |
REDEL / LEMO |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(BRD.00.200.PCSN.PDF, |
1+: $16 10+: $15.84 100+: $15.68 500+: $15.52 1000+: $15.36 |
Wireless infrastructure |
Products:连接器,互连器件--圆形连接器 - 配件 |
Manufacturers: REDEL / LEMO. |
Box | 8375 In Stock | 00 | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Cap (Cover), Blanking | 00 Series Free Receptacle | Compare |
- S912XEG384BCAL
- GMA.2B.040.DR
- BRD.00.200.PCSN