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首页 > Products >Discrete Semiconductor >Transistors - Bipolar (BJT) - Single, Pre-Biased >RN1106MFV,L3F > RN1106MFV,L3F Compare > RN1106MFV,L3F IEGBX66-1-52-50.0-N3-V IEGH6666-27440-1-V Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RN1106MFV,L3F.PDF,
RN1106MFV,L3F.docx,
RN1106MFV,L3F.zip)

RN1106MFV,L3F

RN1106MFV,L3F 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IEGH6666-27440-1-V.PDF,
IEGH6666-27440-1-V.docx,
IEGH6666-27440-1-V.zip)

IEGH6666-27440-1-V

IEGH6666-27440-1-V 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IEGBX66-1-52-50.0-N3-V.PDF,
IEGBX66-1-52-50.0-N3-V.docx,
IEGBX66-1-52-50.0-N3-V.zip)

IEGBX66-1-52-50.0-N3-V

IEGBX66-1-52-50.0-N3-V 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
RN1106MFV,L3F RN1106MFV,L3F

(Alternative models available)

 Toshiba Electronic Devices and Storage Corporation Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RN1106MFV,L3F.PDF,
RN1106MFV,L3F.docx,
RN1106MFV,L3F.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Advanced driver assistance systems (ADAS)
Grid infrastructure
Mobile phones

Products:分立半导体产品--晶体管 - 双极（BJT） - 单,预偏置

Manufacturers: Toshiba Electronic Devices and Storage Corporation.
omoelec is one of the Distributors.
Wide range of applications.

Tape & Reel (TR)Cut Tape (CT)Digi-Reel® 9743 In Stock - Active - - - - - - - - - Surface Mount - - - - - - Compare
IEGH6666-27440-1-V IEGH6666-27440-1-V

(Alternative models available)

 Sensata Technologies – Airpax Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IEGH6666-27440-1-V.PDF,
IEGH6666-27440-1-V.docx,
IEGH6666-27440-1-V.zip)

1+: $183

10+: $181.17

100+: $179.34

500+: $177.51

1000+: $175.68

 Wearables (non-medical)

Products:电路保护--断路器

Manufacturers: Sensata Technologies – Airpax.
omoelec is one of the Distributors.
Wide range of applications.

6921 In Stock IEG Active - - - - - - - - - Panel Mount - - - - - - Compare
IEGBX66-1-52-50.0-N3-V IEGBX66-1-52-50.0-N3-V

(Alternative models available)

 Sensata Technologies – Airpax Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IEGBX66-1-52-50.0-N3-V.PDF,
IEGBX66-1-52-50.0-N3-V.docx,
IEGBX66-1-52-50.0-N3-V.zip)

1+: $74

10+: $73.26

100+: $72.52

500+: $71.78

1000+: $71.04

 Infotainment & cluster

Products:电路保护--断路器

Manufacturers: Sensata Technologies – Airpax.
omoelec is one of the Distributors.
Wide range of applications.

8955 In Stock IEG Active - - - - - - - - - Panel Mount - - - - - - Compare
  • RN1106MFV,L3F
  • IEGH6666-27440-1-V
  • IEGBX66-1-52-50.0-N3-V