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首页 > Products >Integrated Circuits (ICs) >Interface - CODECs >PEB3322HLV1.4 > PEB3322HLV1.4 Compare > PEB3322HLV1.4 CDV30FF113FO3F CMR07F103GODM Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(PEB3322HLV1.4.PDF,
PEB3322HLV1.4.docx,
PEB3322HLV1.4.zip)

PEB3322HLV1.4

PEB3322HLV1.4 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CMR07F103GODM.PDF,
CMR07F103GODM.docx,
CMR07F103GODM.zip)

CMR07F103GODM

CMR07F103GODM 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CDV30FF113FO3F.PDF,
CDV30FF113FO3F.docx,
CDV30FF113FO3F.zip)

CDV30FF113FO3F

CDV30FF113FO3F 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
PEB3322HLV1.4 PEB3322HLV1.4

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(PEB3322HLV1.4.PDF,
PEB3322HLV1.4.docx,
PEB3322HLV1.4.zip)

1+: $20

10+: $19.8

100+: $19.6

500+: $19.4

1000+: $19.2

 Hybrid, electric & powertrain systems
Factory automation & control
TV

Products:集成电路（IC）--接口 - 编解码器

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

2597 In Stock * Active - - - - - - - - - - - - - - - - Compare
CMR07F103GODM CMR07F103GODM

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CMR07F103GODM.PDF,
CMR07F103GODM.docx,
CMR07F103GODM.zip)

1+: $33

10+: $32.67

100+: $32.34

500+: $32.01

1000+: $31.68

 Body electronics & lighting
Data storage

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1101 In Stock CMR Active - - - - - - - - -55°C ~ 125°C Through Hole 0.799"" L x 0.339"" W (20.30mm x 8.60mm) 0.890"" (22.60mm) - - - - Compare
CDV30FF113FO3F CDV30FF113FO3F

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CDV30FF113FO3F.PDF,
CDV30FF113FO3F.docx,
CDV30FF113FO3F.zip)

1+: $47

10+: $46.53

100+: $46.06

500+: $45.59

1000+: $45.12

 Grid infrastructure

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

3009 In Stock CDV30 Active - - - - - - - - -55°C ~ 125°C Through Hole - - - - - - Compare
  • PEB3322HLV1.4
  • CMR07F103GODM
  • CDV30FF113FO3F