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首页 > Products >Optoelectronics >Infrared, UV, Visible Emitters >MTE325H33-UV > MTE325H33-UV Compare > MTE325H33-UV 2-1195687-3 XSG.00.250.NTNZ Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MTE325H33-UV.PDF,
MTE325H33-UV.docx,
MTE325H33-UV.zip)

MTE325H33-UV

MTE325H33-UV 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XSG.00.250.NTNZ.PDF,
XSG.00.250.NTNZ.docx,
XSG.00.250.NTNZ.zip)

XSG.00.250.NTNZ

XSG.00.250.NTNZ 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2-1195687-3.PDF,
2-1195687-3.docx,
2-1195687-3.zip)

2-1195687-3

2-1195687-3 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
MTE325H33-UV MTE325H33-UV

(Alternative models available)

 Marktech Optoelectronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MTE325H33-UV.PDF,
MTE325H33-UV.docx,
MTE325H33-UV.zip)

1+: $111

10+: $109.89

100+: $108.78

500+: $107.67

1000+: $106.56

 Datacom module

Products:光电器件--红外线、紫外线、可见光发射器

Manufacturers: Marktech Optoelectronics.
omoelec is one of the Distributors.
Wide range of applications.

419 In Stock MTE-H33 Active Ultraviolet (UV) - - - - - - - -30°C ~ 80°C (TA) Through Hole - - - - - - Compare
XSG.00.250.NTNZ XSG.00.250.NTNZ

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(XSG.00.250.NTNZ.PDF,
XSG.00.250.NTNZ.docx,
XSG.00.250.NTNZ.zip)

1+: $26

10+: $25.74

100+: $25.48

500+: $25.22

1000+: $24.96

 Hybrid, electric & powertrain systems
Tablets

Products:连接器，互连器件--同轴连接器（RF）组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

2846 In Stock 00 Active - - - - - - - - - Panel Mount, Through Hole, Right Angle - - - - - - Compare
2-1195687-3 2-1195687-3

(Alternative models available)

 TE Connectivity Aerospace Defense and Marine Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2-1195687-3.PDF,
2-1195687-3.docx,
2-1195687-3.zip)

1+: $184

10+: $182.16

100+: $180.32

500+: $178.48

1000+: $176.64

 Wireless infrastructure
Wearables (non-medical)

Products:连接器，互连器件--同轴连接器（RF）组件

Manufacturers: TE Connectivity Aerospace Defense and Marine.
omoelec is one of the Distributors.
Wide range of applications.

4967 In Stock * Active - - - - - - - - - - - - - - - - Compare
  • MTE325H33-UV
  • XSG.00.250.NTNZ
  • 2-1195687-3