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首页 > Products >Integrated Circuits (ICs) >Interface - Telecom >MSP-US-TRF6900 > MSP-US-TRF6900 Compare > MSP-US-TRF6900 CDV30FF153FO3F MCM01-001ED401K-F Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MSP-US-TRF6900.PDF,
MSP-US-TRF6900.docx,
MSP-US-TRF6900.zip)

MSP-US-TRF6900

MSP-US-TRF6900 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MCM01-001ED401K-F.PDF,
MCM01-001ED401K-F.docx,
MCM01-001ED401K-F.zip)

MCM01-001ED401K-F

MCM01-001ED401K-F 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CDV30FF153FO3F.PDF,
CDV30FF153FO3F.docx,
CDV30FF153FO3F.zip)

CDV30FF153FO3F

CDV30FF153FO3F 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
MSP-US-TRF6900 MSP-US-TRF6900

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MSP-US-TRF6900.PDF,
MSP-US-TRF6900.docx,
MSP-US-TRF6900.zip)

1+: $132

10+: $130.68

100+: $129.36

500+: $128.04

1000+: $126.72

 Grid infrastructure
Data storage
Home theater & entertainment

Products:集成电路（IC）--接口 - 电信

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1982 In Stock * Active - - - - - - - - - - - - - - - - Compare
MCM01-001ED401K-F MCM01-001ED401K-F

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MCM01-001ED401K-F.PDF,
MCM01-001ED401K-F.docx,
MCM01-001ED401K-F.zip)

1+: $4

10+: $3.96

100+: $3.92

500+: $3.88

1000+: $3.84

 Building automation
Factory automation & control
Connected peripherals & printers

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1427 In Stock MCM01 Active - - - - - - - - -55°C ~ 200°C Surface Mount 0.460"" L x 0.400"" W (11.68mm x 10.16mm) - - - - - Compare
CDV30FF153FO3F CDV30FF153FO3F

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CDV30FF153FO3F.PDF,
CDV30FF153FO3F.docx,
CDV30FF153FO3F.zip)

1+: $47

10+: $46.53

100+: $46.06

500+: $45.59

1000+: $45.12

 Appliances
Power delivery

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

3312 In Stock CDV30 Active - - - - - - - - -55°C ~ 125°C Through Hole - - - - - - Compare
  • MSP-US-TRF6900
  • MCM01-001ED401K-F
  • CDV30FF153FO3F