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首页 > Products >Capacitors >Tantalum - Polymer Capacitors >M551B228M010AG > M551B228M010AG Compare > M551B228M010AG 100USC1000MEFCSN22X30 16MXC68000MEFCSN35X50 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(M551B228M010AG.PDF,
M551B228M010AG.docx,
M551B228M010AG.zip)

M551B228M010AG

M551B228M010AG 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(16MXC68000MEFCSN35X50.PDF,
16MXC68000MEFCSN35X50.docx,
16MXC68000MEFCSN35X50.zip)

16MXC68000MEFCSN35X50

16MXC68000MEFCSN35X50 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(100USC1000MEFCSN22X30.PDF,
100USC1000MEFCSN22X30.docx,
100USC1000MEFCSN22X30.zip)

100USC1000MEFCSN22X30

100USC1000MEFCSN22X30 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
M551B228M010AG M551B228M010AG

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(M551B228M010AG.PDF,
M551B228M010AG.docx,
M551B228M010AG.zip)

1+: $265

10+: $262.35

100+: $259.7

500+: $257.05

1000+: $254.4

 Wireless infrastructure
Industrial transport (non-car & non-light truck)
Mobile phones

Products:电容器--钽 - 聚合物电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

2222 In Stock M55 Active Hermetically Sealed - - - - - - - -55°C ~ 125°C Chassis Mount 1.906"" L x 1.110"" W (48.40mm x 28.20mm) 0.445"" (11.30mm) - - - - Compare
16MXC68000MEFCSN35X50 16MXC68000MEFCSN35X50

(Alternative models available)

 Rubycon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(16MXC68000MEFCSN35X50.PDF,
16MXC68000MEFCSN35X50.docx,
16MXC68000MEFCSN35X50.zip)

1+: $6

10+: $5.94

100+: $5.88

500+: $5.82

1000+: $5.76

 Aerospace & defense

Products:电容器--铝电解电容器

Manufacturers: Rubycon.
omoelec is one of the Distributors.
Wide range of applications.

2165 In Stock MXC Active - - - - - - - - -40°C ~ 105°C Through Hole 1.378"" Dia (35.00mm) 2.047"" (52.00mm) - - - - Compare
100USC1000MEFCSN22X30 100USC1000MEFCSN22X30

(Alternative models available)

 Rubycon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(100USC1000MEFCSN22X30.PDF,
100USC1000MEFCSN22X30.docx,
100USC1000MEFCSN22X30.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Datacom module
Mobile phones

Products:电容器--铝电解电容器

Manufacturers: Rubycon.
omoelec is one of the Distributors.
Wide range of applications.

8180 In Stock USC Active - - - - - - - - -40°C ~ 85°C Through Hole 0.866"" Dia (22.00mm) 1.260"" (32.00mm) - - - - Compare
  • M551B228M010AG
  • 16MXC68000MEFCSN35X50
  • 100USC1000MEFCSN22X30