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首页 > Products >Circuit Protection >Circuit Breakers >IDGN11-33136-2 > IDGN11-33136-2 Compare > IDGN11-33136-2 IRLR3110ZPBF BSP88L6327 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IDGN11-33136-2.PDF,
IDGN11-33136-2.docx,
IDGN11-33136-2.zip)

IDGN11-33136-2

IDGN11-33136-2 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BSP88L6327.PDF,
BSP88L6327.docx,
BSP88L6327.zip)

BSP88L6327

BSP88L6327 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IRLR3110ZPBF.PDF,
IRLR3110ZPBF.docx,
IRLR3110ZPBF.zip)

IRLR3110ZPBF

IRLR3110ZPBF 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
IDGN11-33136-2 IDGN11-33136-2

(Alternative models available)

 Sensata Technologies – Airpax Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IDGN11-33136-2.PDF,
IDGN11-33136-2.docx,
IDGN11-33136-2.zip)

1+: $90

10+: $89.1

100+: $88.2

500+: $87.3

1000+: $86.4

 Data center & enterprise computing

Products:电路保护--断路器

Manufacturers: Sensata Technologies – Airpax.
omoelec is one of the Distributors.
Wide range of applications.

5653 In Stock IDG Active - - - - - - - - - Panel Mount - - - - - - Compare
BSP88L6327 BSP88L6327

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BSP88L6327.PDF,
BSP88L6327.docx,
BSP88L6327.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Factory automation & control
Data storage

Products:分立半导体产品--晶体管 - FET, MOSFET - 单个

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

4194 In Stock * Active - - - - - - - - - - - - - - - - Compare
IRLR3110ZPBF IRLR3110ZPBF

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(IRLR3110ZPBF.PDF,
IRLR3110ZPBF.docx,
IRLR3110ZPBF.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wired networking

Products:分立半导体产品--晶体管 - FET, MOSFET - 单个

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

3135 In Stock HEXFET® Active - - - - - - - - -55°C ~ 175°C (TJ) Surface Mount - - - - - - Compare
  • IDGN11-33136-2
  • BSP88L6327
  • IRLR3110ZPBF