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首页 > Products >Cables, Wires - Management >Heat Shrink Boots, Caps >HSEC1.0-X > HSEC1.0-X Compare > HSEC1.0-X FFA.0S.650.CTLC37 083-8SP-1004 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HSEC1.0-X.PDF,
HSEC1.0-X.docx,
HSEC1.0-X.zip)

HSEC1.0-X

HSEC1.0-X 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(083-8SP-1004.PDF,
083-8SP-1004.docx,
083-8SP-1004.zip)

083-8SP-1004

083-8SP-1004 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FFA.0S.650.CTLC37.PDF,
FFA.0S.650.CTLC37.docx,
FFA.0S.650.CTLC37.zip)

FFA.0S.650.CTLC37

FFA.0S.650.CTLC37 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
HSEC1.0-X HSEC1.0-X

(Alternative models available)

 Panduit Corporation Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HSEC1.0-X.PDF,
HSEC1.0-X.docx,
HSEC1.0-X.zip)

1+: $10

10+: $9.9

100+: $9.8

500+: $9.7

1000+: $9.6

 Hybrid, electric & powertrain systems
Factory automation & control
Data storage

Products:电缆，电线 - 管理--热缩套，帽盖

Manufacturers: Panduit Corporation.
omoelec is one of the Distributors.
Wide range of applications.

8740 In Stock Pan-Shrink™ WET-SHRINK™ HSEC Active Cap - - - - - - - - - - - - - - - Compare
083-8SP-1004 083-8SP-1004

(Alternative models available)

 Connex (Amphenol RF) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(083-8SP-1004.PDF,
083-8SP-1004.docx,
083-8SP-1004.zip)

1+: $29

10+: $28.71

100+: $28.42

500+: $28.13

1000+: $27.84

 Datacom module
Grid infrastructure
Enterprise machine

Products:连接器，互连器件--同轴连接器（RF）组件

Manufacturers: Connex (Amphenol RF).
omoelec is one of the Distributors.
Wide range of applications.

8129 In Stock - Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
FFA.0S.650.CTLC37 FFA.0S.650.CTLC37

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FFA.0S.650.CTLC37.PDF,
FFA.0S.650.CTLC37.docx,
FFA.0S.650.CTLC37.zip)

1+: $32

10+: $31.68

100+: $31.36

500+: $31.04

1000+: $30.72

 Appliances
Grid infrastructure
Data storage

Products:连接器，互连器件--同轴连接器（RF）组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

834 In Stock 0S Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
  • HSEC1.0-X
  • 083-8SP-1004
  • FFA.0S.650.CTLC37