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首页 > Products >Connectors, Interconnects >Fiber Optic Connectors - Housings >HSCM-2SPH2-B1(60) > HSCM-2SPH2-B1(60) Compare > HSCM-2SPH2-B1(60) GS303J1K B57164K0470J052 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HSCM-2SPH2-B1(60).PDF,
HSCM-2SPH2-B1(60).docx,
HSCM-2SPH2-B1(60).zip)

HSCM-2SPH2-B1(60)

HSCM-2SPH2-B1(60) 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B57164K0470J052.PDF,
B57164K0470J052.docx,
B57164K0470J052.zip)

B57164K0470J052

B57164K0470J052 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(GS303J1K.PDF,
GS303J1K.docx,
GS303J1K.zip)

GS303J1K

GS303J1K 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
HSCM-2SPH2-B1(60) HSCM-2SPH2-B1(60)

(Alternative models available)

 Hirose Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HSCM-2SPH2-B1(60).PDF,
HSCM-2SPH2-B1(60).docx,
HSCM-2SPH2-B1(60).zip)

1+: $10

10+: $9.9

100+: $9.8

500+: $9.7

1000+: $9.6

 Wearables (non-medical)
Grid infrastructure
Infotainment & cluster

Products:连接器，互连器件--光纤连接器 - 外壳

Manufacturers: Hirose.
omoelec is one of the Distributors.
Wide range of applications.

3431 In Stock HSC Active - - - - - - - - - Free Hanging (In-Line) - - - - - HSC Ferrules Compare
B57164K0470J052 B57164K0470J052

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B57164K0470J052.PDF,
B57164K0470J052.docx,
B57164K0470J052.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Factory automation & control
Portable electronics

Products:传感器，变送器--温度传感器 - NTC热敏电阻

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

1646 In Stock - Active - - - - - - - - -55°C ~ 125°C Through Hole - - - - - - Compare
GS303J1K GS303J1K

(Alternative models available)

 Wickmann / Littelfuse Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(GS303J1K.PDF,
GS303J1K.docx,
GS303J1K.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wireless infrastructure
Data center & enterprise computing
Connected peripherals & printers

Products:传感器，变送器--温度传感器 - NTC热敏电阻

Manufacturers: Wickmann / Littelfuse.
omoelec is one of the Distributors.
Wide range of applications.

6803 In Stock GS Active - - - - - - - - 300°C Through Hole - - - - - - Compare
  • HSCM-2SPH2-B1(60)
  • B57164K0470J052
  • GS303J1K