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首页 > Products >RF/IF and RFID >RF Misc ICs and Modules >HFA3664IA > HFA3664IA Compare > HFA3664IA RNL1C222MDS1 RNL1C182MDS1 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HFA3664IA.PDF,
HFA3664IA.docx,
HFA3664IA.zip)

HFA3664IA

HFA3664IA 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNL1C182MDS1.PDF,
RNL1C182MDS1.docx,
RNL1C182MDS1.zip)

RNL1C182MDS1

RNL1C182MDS1 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNL1C222MDS1.PDF,
RNL1C222MDS1.docx,
RNL1C222MDS1.zip)

RNL1C222MDS1

RNL1C222MDS1 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
HFA3664IA HFA3664IA

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HFA3664IA.PDF,
HFA3664IA.docx,
HFA3664IA.zip)

1+: $6

10+: $5.94

100+: $5.88

500+: $5.82

1000+: $5.76

 Grid infrastructure

Products:射频和无线--RF 其它 IC 和模块

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

877 In Stock * Active - - - - - - - - - - - - - - - - Compare
RNL1C182MDS1 RNL1C182MDS1

(Alternative models available)

 Nichicon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNL1C182MDS1.PDF,
RNL1C182MDS1.docx,
RNL1C182MDS1.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Building automation
Portable electronics

Products:电容器--铝 - 聚合物电容器

Manufacturers: Nichicon.
omoelec is one of the Distributors.
Wide range of applications.

9524 In Stock FPCAP, RNL - Polymer - - - - - - - -55°C ~ 105°C Through Hole 0.394" Dia (10.00mm) 0.846" (21.50mm) - - - - Compare
RNL1C222MDS1 RNL1C222MDS1

(Alternative models available)

 Nichicon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNL1C222MDS1.PDF,
RNL1C222MDS1.docx,
RNL1C222MDS1.zip)

1+: $3

10+: $2.97

100+: $2.94

500+: $2.91

1000+: $2.88

 Infotainment & cluster
Mobile phones

Products:电容器--铝 - 聚合物电容器

Manufacturers: Nichicon.
omoelec is one of the Distributors.
Wide range of applications.

1918 In Stock FPCAP, RNL - Polymer - - - - - - - -55°C ~ 105°C Through Hole 0.394" Dia (10.00mm) 0.846" (21.50mm) - - - - Compare
  • HFA3664IA
  • RNL1C182MDS1
  • RNL1C222MDS1