Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
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GMA.3B.070.DB
(Alternative models available) |
REDEL / LEMO |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(GMA.3B.070.DB.PDF, |
1+: $7 10+: $6.93 100+: $6.86 500+: $6.79 1000+: $6.72 |
Datacom module Tablets |
Products:连接器,互连器件--圆形连接器 - 配件 |
Manufacturers: REDEL / LEMO. |
Bag | 6325 In Stock | 3B | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Strain Relief | 3B, 3E, 3K Series Connector | Compare | |
SPHWW1HDN825YHW3EE
(Alternative models available) |
Samsung Semiconductor |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(SPHWW1HDN825YHW3EE.PDF, |
1+: $1 10+: $0.99 100+: $0.98 500+: $0.97 1000+: $0.96 |
Motor drives |
Products:光电器件--COB,引擎,模块,灯条 |
Manufacturers: Samsung Semiconductor. |
Tray | 6244 In Stock | LC006B Gen2 | Not For New Designs | Chip On Board (COB) | - | - | - | - | - | - | - | - | - | 13.50mm L x 13.50mm W | - | - | - | - | - | Compare | |
SPHWHAHDND25YZQ3D2
(Alternative models available) |
Samsung Semiconductor |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(SPHWHAHDND25YZQ3D2.PDF, |
1+: $1 10+: $0.99 100+: $0.98 500+: $0.97 1000+: $0.96 |
Appliances |
Products:光电器件--COB,引擎,模块,灯条 |
Manufacturers: Samsung Semiconductor. |
Tray | 6566 In Stock | LC013D Gen2 | Active | Chip On Board (COB) | - | - | - | - | - | - | - | - | - | 13.50mm L x 13.50mm W | - | - | - | - | - | Compare |
- GMA.3B.070.DB
- SPHWW1HDN825YHW3EE
- SPHWHAHDND25YZQ3D2