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首页 > Products >Discrete Semiconductor >Diodes - Bridge Rectifiers >GBPC3510T > GBPC3510T Compare > GBPC3510T RNU1E221MDNASQ RNU1D681MDN1 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(GBPC3510T.PDF,
GBPC3510T.docx,
GBPC3510T.zip)

GBPC3510T

GBPC3510T 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNU1D681MDN1.PDF,
RNU1D681MDN1.docx,
RNU1D681MDN1.zip)

RNU1D681MDN1

RNU1D681MDN1 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNU1E221MDNASQ.PDF,
RNU1E221MDNASQ.docx,
RNU1E221MDNASQ.zip)

RNU1E221MDNASQ

RNU1E221MDNASQ 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
GBPC3510T GBPC3510T

(Alternative models available)

 GeneSiC Semiconductor Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(GBPC3510T.PDF,
GBPC3510T.docx,
GBPC3510T.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Gaming

Products:分立半导体产品--二极管 - 桥式整流器

Manufacturers: GeneSiC Semiconductor.
omoelec is one of the Distributors.
Wide range of applications.

8084 In Stock - Active - - - - - - - - -55°C ~ 150°C (TJ) Through Hole - - - - - - Compare
RNU1D681MDN1 RNU1D681MDN1

(Alternative models available)

 Nichicon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNU1D681MDN1.PDF,
RNU1D681MDN1.docx,
RNU1D681MDN1.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Building automation
Medical
Gaming

Products:电容器--铝 - 聚合物电容器

Manufacturers: Nichicon.
omoelec is one of the Distributors.
Wide range of applications.

4921 In Stock FPCAP, RNU - Polymer - - - - - - - -55°C ~ 105°C Through Hole 0.394" Dia (10.00mm) 0.551" (14.00mm) - - - - Compare
RNU1E221MDNASQ RNU1E221MDNASQ

(Alternative models available)

 Nichicon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(RNU1E221MDNASQ.PDF,
RNU1E221MDNASQ.docx,
RNU1E221MDNASQ.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Grid infrastructure
Wearables (non-medical)

Products:电容器--铝 - 聚合物电容器

Manufacturers: Nichicon.
omoelec is one of the Distributors.
Wide range of applications.

3297 In Stock FPCAP, RNU - Polymer - - - - - - - -55°C ~ 105°C Through Hole 0.315" Dia (8.00mm) 0.512" (13.00mm) - - - - Compare
  • GBPC3510T
  • RNU1D681MDN1
  • RNU1E221MDNASQ