Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
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FIN2.88RD25
(Alternative models available) |
Techflex |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(FIN2.88RD25.PDF, |
1+: $290 10+: $287.1 100+: $284.2 500+: $281.3 1000+: $278.4 |
Mobile phones |
Products:电缆,电线 - 管理--保护软管,实心管,衬套 |
Manufacturers: Techflex. |
Spool | 4132 In Stock | FireFlex® | Active | Sleeving, Insulated | - | - | - | - | - | - | - | -54°C ~ 260°C | - | - | - | - | - | - | - | Compare |
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B32529C3334J289
(Alternative models available) |
TDK EPCOS |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(B32529C3334J289.PDF, |
1+: $0 10+: $0 100+: $0 500+: $0 1000+: $0 |
Wireless infrastructure |
Products:电容器--薄膜电容器 |
Manufacturers: TDK EPCOS. |
Tape & Box (TB) | 3993 In Stock | B32529 | Active | - | - | - | - | - | - | - | - | -55°C ~ 125°C | Through Hole | 0.307"" L x 0.307"" W (7.80mm x 7.80mm) | 0.512"" (13.00mm) | - | - | - | - | Compare |
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F862DU125K310ZV054
(Alternative models available) |
KEMET |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(F862DU125K310ZV054.PDF, |
1+: $1 10+: $0.99 100+: $0.98 500+: $0.97 1000+: $0.96 |
Wired networking Test & measurement Mobile phones |
Products:电容器--薄膜电容器 |
Manufacturers: KEMET. |
9593 In Stock | F862 | Active | - | - | - | - | - | - | - | - | -40°C ~ 110°C | Through Hole | 1.024"" L x 0.512"" W (26.00mm x 13.00mm) | 0.866"" (22.00mm) | - | - | - | - | Compare |
- FIN2.88RD25
- B32529C3334J289
- F862DU125K310ZV054