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首页 > Products >Connectors, Interconnects >D-Sub, D-Shaped Connectors - Backshells, Hoods >FI-20-CV2(50) > FI-20-CV2(50) Compare > FI-20-CV2(50) ASDAK-MSCSM120AM03CT6LIAG-01 SIP32454EVB Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FI-20-CV2(50).PDF,
FI-20-CV2(50).docx,
FI-20-CV2(50).zip)

FI-20-CV2(50)

FI-20-CV2(50) 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(SIP32454EVB.PDF,
SIP32454EVB.docx,
SIP32454EVB.zip)

SIP32454EVB

SIP32454EVB 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(ASDAK-MSCSM120AM03CT6LIAG-01.PDF,
ASDAK-MSCSM120AM03CT6LIAG-01.docx,
ASDAK-MSCSM120AM03CT6LIAG-01.zip)

ASDAK-MSCSM120AM03CT6LIAG-01

ASDAK-MSCSM120AM03CT6LIAG-01 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
FI-20-CV2(50) FI-20-CV2(50)

(Alternative models available)

 Hirose Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FI-20-CV2(50).PDF,
FI-20-CV2(50).docx,
FI-20-CV2(50).zip)

1+: $7

10+: $6.93

100+: $6.86

500+: $6.79

1000+: $6.72

 Body electronics & lighting
Industrial transport (non-car & non-light truck)
Gaming

Products:连接器，互连器件--D-Sub，D 形连接器 - 底壳，罩

Manufacturers: Hirose.
omoelec is one of the Distributors.
Wide range of applications.

4708 In Stock FI Active - - - - - - - - - - - - - - Two Piece Backshell - Compare
SIP32454EVB SIP32454EVB

(Alternative models available)

 Vishay / Siliconix Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(SIP32454EVB.PDF,
SIP32454EVB.docx,
SIP32454EVB.zip)

1+: $13

10+: $12.87

100+: $12.74

500+: $12.61

1000+: $12.48

 Connected peripherals & printers

Products:开发板，套件，编程器--评估和演示板及套件

Manufacturers: Vishay / Siliconix.
omoelec is one of the Distributors.
Wide range of applications.

9473 In Stock - Active Power Management - - - - - - - - - - - - - - - Compare
ASDAK-MSCSM120AM03CT6LIAG-01 ASDAK-MSCSM120AM03CT6LIAG-01

(Alternative models available)

 Roving Networks / Microchip Technology Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(ASDAK-MSCSM120AM03CT6LIAG-01.PDF,
ASDAK-MSCSM120AM03CT6LIAG-01.docx,
ASDAK-MSCSM120AM03CT6LIAG-01.zip)

1+: $1420

10+: $1405.8

100+: $1391.6

500+: $1377.4

1000+: $1363.2

 Mobile phones

Products:开发板，套件，编程器--评估和演示板及套件

Manufacturers: Roving Networks / Microchip Technology.
omoelec is one of the Distributors.
Wide range of applications.

7474 In Stock - Active Power Management - - - - - - - - - - - - - - - Compare
  • FI-20-CV2(50)
  • SIP32454EVB
  • ASDAK-MSCSM120AM03CT6LIAG-01