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首页 > Products >Connectors, Interconnects >Fiber Optic Connectors - Adapters >FAP12WFDBDBDLCZ > FAP12WFDBDBDLCZ Compare > FAP12WFDBDBDLCZ 35MXC8200MEFCSN30X25 B43644B9567M000 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FAP12WFDBDBDLCZ.PDF,
FAP12WFDBDBDLCZ.docx,
FAP12WFDBDBDLCZ.zip)

FAP12WFDBDBDLCZ

FAP12WFDBDBDLCZ 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B43644B9567M000.PDF,
B43644B9567M000.docx,
B43644B9567M000.zip)

B43644B9567M000

B43644B9567M000 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(35MXC8200MEFCSN30X25.PDF,
35MXC8200MEFCSN30X25.docx,
35MXC8200MEFCSN30X25.zip)

35MXC8200MEFCSN30X25

35MXC8200MEFCSN30X25 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
FAP12WFDBDBDLCZ FAP12WFDBDBDLCZ

(Alternative models available)

 Panduit Corporation Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(FAP12WFDBDBDLCZ.PDF,
FAP12WFDBDBDLCZ.docx,
FAP12WFDBDBDLCZ.zip)

1+: $308

10+: $304.92

100+: $301.84

500+: $298.76

1000+: $295.68

 Aerospace & defense
Pro audio, video & signage
Gaming

Products:连接器，互连器件--光纤连接器 - 适配器

Manufacturers: Panduit Corporation.
omoelec is one of the Distributors.
Wide range of applications.

1751 In Stock * Active - - - - - - - - - - - - - - - - Compare
B43644B9567M000 B43644B9567M000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B43644B9567M000.PDF,
B43644B9567M000.docx,
B43644B9567M000.zip)

1+: $8

10+: $7.92

100+: $7.84

500+: $7.76

1000+: $7.68

 Broadband fixed line access
Gaming

Products:电容器--铝电解电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

7654 In Stock B43644 Active - - - - - - - - -40°C ~ 105°C Through Hole 1.378"" Dia (35.00mm) 1.654"" (42.00mm) - - - - Compare
35MXC8200MEFCSN30X25 35MXC8200MEFCSN30X25

(Alternative models available)

 Rubycon Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(35MXC8200MEFCSN30X25.PDF,
35MXC8200MEFCSN30X25.docx,
35MXC8200MEFCSN30X25.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Grid infrastructure

Products:电容器--铝电解电容器

Manufacturers: Rubycon.
omoelec is one of the Distributors.
Wide range of applications.

9689 In Stock MXC Active - - - - - - - - -40°C ~ 105°C Through Hole 1.181"" Dia (30.00mm) 1.063"" (27.00mm) - - - - Compare
  • FAP12WFDBDBDLCZ
  • B43644B9567M000
  • 35MXC8200MEFCSN30X25