您好，欢迎来到奥美讯
QQ在线咨询 电话13790846556 EN
询价
首页 产品目录表 品牌库 BOM配单 行业资讯 资质认证 关于我们 联系我们
首页 > Products >Connectors, Interconnects >Circular Connectors >EXG.0B.302.HLN > EXG.0B.302.HLN Compare > EXG.0B.302.HLN M550B348K008AS T541X686K025CH8510 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

EXG.0B.302.HLN

EXG.0B.302.HLN 

Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T541X686K025CH8510.PDF,
T541X686K025CH8510.docx,
T541X686K025CH8510.zip)

T541X686K025CH8510

T541X686K025CH8510 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(M550B348K008AS.PDF,
M550B348K008AS.docx,
M550B348K008AS.zip)

M550B348K008AS

M550B348K008AS 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
EXG.0B.302.HLN EXG.0B.302.HLN

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

1+: $41

10+: $40.59

100+: $40.18

500+: $39.77

1000+: $39.36

 Wireless infrastructure
Electronic point of sale (EPOS)
Home theater & entertainment

Products:连接器，互连器件--圆形连接器组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

3506 In Stock 0B Active - - - - - - - - -55°C ~ 250°C Panel Mount, Through Hole, Right Angle - - - - - - Compare
T541X686K025CH8510 T541X686K025CH8510

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T541X686K025CH8510.PDF,
T541X686K025CH8510.docx,
T541X686K025CH8510.zip)

1+: $15

10+: $14.85

100+: $14.7

500+: $14.55

1000+: $14.4

 Grid infrastructure
Mobile phones

Products:电容器--钽 - 聚合物电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

Tape & Reel (TR) 9760 In Stock KO-CAP® T541 Active Molded - - - - - - - -55°C ~ 125°C Surface Mount 0.287"" L x 0.169"" W (7.30mm x 4.30mm) 0.169"" (4.30mm) - - - - Compare
M550B348K008AS M550B348K008AS

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(M550B348K008AS.PDF,
M550B348K008AS.docx,
M550B348K008AS.zip)

1+: $273

10+: $270.27

100+: $267.54

500+: $264.81

1000+: $262.08

 Electronic point of sale (EPOS)
Test & measurement

Products:电容器--钽 - 聚合物电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

2392 In Stock M55 Active Hermetically Sealed - - - - - - - -55°C ~ 105°C Chassis Mount 1.906"" L x 1.110"" W (48.40mm x 28.20mm) 0.445"" (11.30mm) - - - - Compare
  • EXG.0B.302.HLN
  • T541X686K025CH8510
  • M550B348K008AS