您好，欢迎来到奥美讯
QQ在线咨询 电话13790846556 EN
询价
首页 产品目录表 品牌库 BOM配单 行业资讯 资质认证 关于我们 联系我们
首页 > Products >Connectors, Interconnects >Circular Connectors >EXG.0B.302.HLN > EXG.0B.302.HLN Compare > EXG.0B.302.HLN CD10FD221FO3 MKP386M522160YT5 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

EXG.0B.302.HLN

EXG.0B.302.HLN 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MKP386M522160YT5.PDF,
MKP386M522160YT5.docx,
MKP386M522160YT5.zip)

MKP386M522160YT5

MKP386M522160YT5 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CD10FD221FO3.PDF,
CD10FD221FO3.docx,
CD10FD221FO3.zip)

CD10FD221FO3

CD10FD221FO3 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
EXG.0B.302.HLN EXG.0B.302.HLN

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

1+: $41

10+: $40.59

100+: $40.18

500+: $39.77

1000+: $39.36

 Wireless infrastructure
Electronic point of sale (EPOS)
Home theater & entertainment

Products:连接器，互连器件--圆形连接器组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

3506 In Stock 0B Active - - - - - - - - -55°C ~ 250°C Panel Mount, Through Hole, Right Angle - - - - - - Compare
MKP386M522160YT5 MKP386M522160YT5

(Alternative models available)

 Vishay BC Components/Beyshlag/Draloric Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MKP386M522160YT5.PDF,
MKP386M522160YT5.docx,
MKP386M522160YT5.zip)

1+: $11

10+: $10.89

100+: $10.78

500+: $10.67

1000+: $10.56

 Wired networking

Products:电容器--薄膜电容器

Manufacturers: Vishay BC Components/Beyshlag/Draloric.
omoelec is one of the Distributors.
Wide range of applications.

8275 In Stock MKP386M Active - - - - - - - - -55°C ~ 105°C Chassis Mount 1.319"" L x 0.866"" W (33.50mm x 22.00mm) - - - - - Compare
CD10FD221FO3 CD10FD221FO3

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CD10FD221FO3.PDF,
CD10FD221FO3.docx,
CD10FD221FO3.zip)

1+: $4

10+: $3.96

100+: $3.92

500+: $3.88

1000+: $3.84

 Wired networking
Pro audio, video & signage

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

8281 In Stock CD10 Active - - - - - - - - -55°C ~ 125°C Through Hole 0.390"" L x 0.220"" W (9.90mm x 5.60mm) 0.382"" (9.70mm) - - - - Compare
  • EXG.0B.302.HLN
  • MKP386M522160YT5
  • CD10FD221FO3