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首页 > Products >Connectors, Interconnects >Circular Connectors >EXG.0B.302.HLN > EXG.0B.302.HLN Compare > EXG.0B.302.HLN B32529C0222K000 R76UI122050H4J Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

EXG.0B.302.HLN

EXG.0B.302.HLN 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(R76UI122050H4J.PDF,
R76UI122050H4J.docx,
R76UI122050H4J.zip)

R76UI122050H4J

R76UI122050H4J 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32529C0222K000.PDF,
B32529C0222K000.docx,
B32529C0222K000.zip)

B32529C0222K000

B32529C0222K000 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
EXG.0B.302.HLN EXG.0B.302.HLN

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

1+: $41

10+: $40.59

100+: $40.18

500+: $39.77

1000+: $39.36

 Wireless infrastructure
Electronic point of sale (EPOS)
Home theater & entertainment

Products:连接器，互连器件--圆形连接器组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

3506 In Stock 0B Active - - - - - - - - -55°C ~ 250°C Panel Mount, Through Hole, Right Angle - - - - - - Compare
R76UI122050H4J R76UI122050H4J

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(R76UI122050H4J.PDF,
R76UI122050H4J.docx,
R76UI122050H4J.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Advanced driver assistance systems (ADAS)
Lighting
Enterprise projectors

Products:电容器--薄膜电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

253 In Stock R76H Active - - - - - - - - -55°C ~ 125°C Through Hole 0.709"" L x 0.157"" W (18.00mm x 4.00mm) 0.398"" (10.10mm) - - - - Compare
B32529C0222K000 B32529C0222K000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32529C0222K000.PDF,
B32529C0222K000.docx,
B32529C0222K000.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wired networking
Data center & enterprise computing
Enterprise projectors

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

404 In Stock B32529 Active - - - - - - - - -55°C ~ 125°C Through Hole 0.287"" L x 0.098"" W (7.30mm x 2.50mm) 0.256"" (6.50mm) - - - - Compare
  • EXG.0B.302.HLN
  • R76UI122050H4J
  • B32529C0222K000