您好，欢迎来到奥美讯
QQ在线咨询 电话13790846556 EN
询价
首页 产品目录表 品牌库 BOM配单 行业资讯 资质认证 关于我们 联系我们
首页 > Products >Connectors, Interconnects >Circular Connectors >EXG.0B.302.HLN > EXG.0B.302.HLN Compare > EXG.0B.302.HLN B32332I6606J082 BFC237025823 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

EXG.0B.302.HLN

EXG.0B.302.HLN 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BFC237025823.PDF,
BFC237025823.docx,
BFC237025823.zip)

BFC237025823

BFC237025823 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32332I6606J082.PDF,
B32332I6606J082.docx,
B32332I6606J082.zip)

B32332I6606J082

B32332I6606J082 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
EXG.0B.302.HLN EXG.0B.302.HLN

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EXG.0B.302.HLN.PDF,
EXG.0B.302.HLN.docx,
EXG.0B.302.HLN.zip)

1+: $41

10+: $40.59

100+: $40.18

500+: $39.77

1000+: $39.36

 Wireless infrastructure
Electronic point of sale (EPOS)
Home theater & entertainment

Products:连接器，互连器件--圆形连接器组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

3506 In Stock 0B Active - - - - - - - - -55°C ~ 250°C Panel Mount, Through Hole, Right Angle - - - - - - Compare
BFC237025823 BFC237025823

(Alternative models available)

 Vishay BC Components/Beyshlag/Draloric Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BFC237025823.PDF,
BFC237025823.docx,
BFC237025823.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Datacom module
Pro audio, video & signage

Products:电容器--薄膜电容器

Manufacturers: Vishay BC Components/Beyshlag/Draloric.
omoelec is one of the Distributors.
Wide range of applications.

5510 In Stock MKT370 Active - - - - - - - - -55°C ~ 105°C Through Hole 0.283"" L x 0.098"" W (7.20mm x 2.50mm) 0.256"" (6.50mm) - - - - Compare
B32332I6606J082 B32332I6606J082

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32332I6606J082.PDF,
B32332I6606J082.docx,
B32332I6606J082.zip)

1+: $19

10+: $18.81

100+: $18.62

500+: $18.43

1000+: $18.24

 Advanced driver assistance systems (ADAS)
Wearables (non-medical)

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

4413 In Stock B32332 Active - - - - - - - - -25°C ~ 85°C Chassis, Stud Mount 1.772"" Dia (45.00mm) 4.173"" (106.00mm) - - - - Compare
  • EXG.0B.302.HLN
  • BFC237025823
  • B32332I6606J082