您好，欢迎来到奥美讯
QQ在线咨询 电话13790846556 EN
询价
首页 产品目录表 品牌库 BOM配单 行业资讯 资质认证 关于我们 联系我们
首页 > Products >Development Boards, Kits, Programmers >Evaluation Boards - Embedded - Complex Logic (FPGA >EK-K7-KC705-G-J > EK-K7-KC705-G-J Compare > EK-K7-KC705-G-J B32529C0222K000 R76UI122050H4J Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EK-K7-KC705-G-J.PDF,
EK-K7-KC705-G-J.docx,
EK-K7-KC705-G-J.zip)

EK-K7-KC705-G-J

EK-K7-KC705-G-J 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(R76UI122050H4J.PDF,
R76UI122050H4J.docx,
R76UI122050H4J.zip)

R76UI122050H4J

R76UI122050H4J 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32529C0222K000.PDF,
B32529C0222K000.docx,
B32529C0222K000.zip)

B32529C0222K000

B32529C0222K000 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
EK-K7-KC705-G-J EK-K7-KC705-G-J

(Alternative models available)

 Xilinx Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EK-K7-KC705-G-J.PDF,
EK-K7-KC705-G-J.docx,
EK-K7-KC705-G-J.zip)

1+: $1876

10+: $1857.24

100+: $1838.48

500+: $1819.72

1000+: $1800.96

 Wireless infrastructure
Factory automation & control
Grid infrastructure

Products:开发板，套件，编程器--评估板 - 嵌入式复杂逻辑器件（FPGA，CPLD）

Manufacturers: Xilinx.
omoelec is one of the Distributors.
Wide range of applications.

3855 In Stock Kintex-7 Active FPGA - - - - - - - - - - - - - - Kintex-7 Compare
R76UI122050H4J R76UI122050H4J

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(R76UI122050H4J.PDF,
R76UI122050H4J.docx,
R76UI122050H4J.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Advanced driver assistance systems (ADAS)
Lighting
Enterprise projectors

Products:电容器--薄膜电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

253 In Stock R76H Active - - - - - - - - -55°C ~ 125°C Through Hole 0.709"" L x 0.157"" W (18.00mm x 4.00mm) 0.398"" (10.10mm) - - - - Compare
B32529C0222K000 B32529C0222K000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32529C0222K000.PDF,
B32529C0222K000.docx,
B32529C0222K000.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wired networking
Data center & enterprise computing
Enterprise projectors

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

404 In Stock B32529 Active - - - - - - - - -55°C ~ 125°C Through Hole 0.287"" L x 0.098"" W (7.30mm x 2.50mm) 0.256"" (6.50mm) - - - - Compare
  • EK-K7-KC705-G-J
  • R76UI122050H4J
  • B32529C0222K000