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首页 > Products >Connectors, Interconnects >Circular Connectors >EEG.0B.307.CLL > EEG.0B.307.CLL Compare > EEG.0B.307.CLL 316-83-125-41-018101 DF1-3P-2.5DSA(05) Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EEG.0B.307.CLL.PDF,
EEG.0B.307.CLL.docx,
EEG.0B.307.CLL.zip)

EEG.0B.307.CLL

EEG.0B.307.CLL 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DF1-3P-2.5DSA(05).PDF,
DF1-3P-2.5DSA(05).docx,
DF1-3P-2.5DSA(05).zip)

DF1-3P-2.5DSA(05)

DF1-3P-2.5DSA(05) 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(316-83-125-41-018101.PDF,
316-83-125-41-018101.docx,
316-83-125-41-018101.zip)

316-83-125-41-018101

316-83-125-41-018101 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
EEG.0B.307.CLL EEG.0B.307.CLL

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EEG.0B.307.CLL.PDF,
EEG.0B.307.CLL.docx,
EEG.0B.307.CLL.zip)

1+: $29

10+: $28.71

100+: $28.42

500+: $28.13

1000+: $27.84

 Mobile phones

Products:连接器，互连器件--圆形连接器组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

3942 In Stock 0B Active - - - - - - - - -55°C ~ 250°C Panel Mount - - - - - - Compare
DF1-3P-2.5DSA(05) DF1-3P-2.5DSA(05)

(Alternative models available)

 Hirose Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DF1-3P-2.5DSA(05).PDF,
DF1-3P-2.5DSA(05).docx,
DF1-3P-2.5DSA(05).zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wired networking
Motor drives

Products:连接器，互连器件--矩形连接器 - 针座，公插针

Manufacturers: Hirose.
omoelec is one of the Distributors.
Wide range of applications.

7067 In Stock DF1 Active - - - - - - - - -30°C ~ 85°C Through Hole - - - Board to Cable/Wire - - Compare
316-83-125-41-018101 316-83-125-41-018101

(Alternative models available)

 Preci-Dip Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(316-83-125-41-018101.PDF,
316-83-125-41-018101.docx,
316-83-125-41-018101.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Advanced driver assistance systems (ADAS)
Grid infrastructure
Connected peripherals & printers

Products:连接器，互连器件--矩形连接器 - 针座，插座，母插口

Manufacturers: Preci-Dip.
omoelec is one of the Distributors.
Wide range of applications.

5746 In Stock 316 Active - - - - - - - - -55°C ~ 125°C Through Hole - - - Board to Board - - Compare
  • EEG.0B.307.CLL
  • DF1-3P-2.5DSA(05)
  • 316-83-125-41-018101