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首页 > Products >Connectors, Interconnects >D-Sub, D-Shaped Connectors - Housings >DBMAY25PF225F0 > DBMAY25PF225F0 Compare > DBMAY25PF225F0 2N3763 2SC6082-1EX Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DBMAY25PF225F0.PDF,
DBMAY25PF225F0.docx,
DBMAY25PF225F0.zip)

DBMAY25PF225F0

DBMAY25PF225F0 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2SC6082-1EX.PDF,
2SC6082-1EX.docx,
2SC6082-1EX.zip)

2SC6082-1EX

2SC6082-1EX 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2N3763.PDF,
2N3763.docx,
2N3763.zip)

2N3763

2N3763 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
DBMAY25PF225F0 DBMAY25PF225F0

(Alternative models available)

 VEAM Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(DBMAY25PF225F0.PDF,
DBMAY25PF225F0.docx,
DBMAY25PF225F0.zip)

1+: $33

10+: $32.67

100+: $32.34

500+: $32.01

1000+: $31.68

 Wireless infrastructure

Products:连接器，互连器件--D-Sub，D 形连接器 - 外壳

Manufacturers: VEAM.
omoelec is one of the Distributors.
Wide range of applications.

109 In Stock * Active - - - - - - - - - - - - - - - - Compare
2SC6082-1EX 2SC6082-1EX

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2SC6082-1EX.PDF,
2SC6082-1EX.docx,
2SC6082-1EX.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wireless infrastructure
PC & notebooks

Products:分立半导体产品--晶体管 - 双极（BJT） - 单

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

5398 In Stock * Active - - - - - - - - - - - - - - - - Compare
2N3763 2N3763

(Alternative models available)

 Microsemi Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2N3763.PDF,
2N3763.docx,
2N3763.zip)

1+: $24

10+: $23.76

100+: $23.52

500+: $23.28

1000+: $23.04

 Hybrid, electric & powertrain systems
Medical
Wearables (non-medical)

Products:分立半导体产品--晶体管 - 双极（BJT） - 单

Manufacturers: Microsemi.
omoelec is one of the Distributors.
Wide range of applications.

130 In Stock * Active - - - - - - - - - - - - - - - - Compare
  • DBMAY25PF225F0
  • 2SC6082-1EX
  • 2N3763