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首页 > Products >Capacitors >Mica and PTFE Capacitors >CMR08F623GOCM > CMR08F623GOCM Compare > CMR08F623GOCM HPH1-B-10-UA TSW-131-26-G-D Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CMR08F623GOCM.PDF,
CMR08F623GOCM.docx,
CMR08F623GOCM.zip)

CMR08F623GOCM

CMR08F623GOCM 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TSW-131-26-G-D.PDF,
TSW-131-26-G-D.docx,
TSW-131-26-G-D.zip)

TSW-131-26-G-D

TSW-131-26-G-D 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HPH1-B-10-UA.PDF,
HPH1-B-10-UA.docx,
HPH1-B-10-UA.zip)

HPH1-B-10-UA

HPH1-B-10-UA 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
CMR08F623GOCM CMR08F623GOCM

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CMR08F623GOCM.PDF,
CMR08F623GOCM.docx,
CMR08F623GOCM.zip)

1+: $107

10+: $105.93

100+: $104.86

500+: $103.79

1000+: $102.72

 Wireless infrastructure
Enterprise machine

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1562 In Stock CMR Active - - - - - - - - -55°C ~ 125°C Through Hole 1.469"" L x 0.449"" W (37.30mm x 11.40mm) 0.917"" (23.30mm) - - - - Compare
TSW-131-26-G-D TSW-131-26-G-D

(Alternative models available)

 Samtec, Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TSW-131-26-G-D.PDF,
TSW-131-26-G-D.docx,
TSW-131-26-G-D.zip)

1+: $8

10+: $7.92

100+: $7.84

500+: $7.76

1000+: $7.68

 Aerospace & defense
Tablets

Products:连接器，互连器件--矩形连接器 - 针座，公插针

Manufacturers: Samtec, Inc..
omoelec is one of the Distributors.
Wide range of applications.

1456 In Stock TSW Active - - - - - - - - -55°C ~ 125°C Through Hole - - - Board to Board or Cable - - Compare
HPH1-B-10-UA HPH1-B-10-UA

(Alternative models available)

 Adam Tech Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HPH1-B-10-UA.PDF,
HPH1-B-10-UA.docx,
HPH1-B-10-UA.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 PC & notebooks

Products:连接器，互连器件--矩形连接器 - 针座，公插针

Manufacturers: Adam Tech.
omoelec is one of the Distributors.
Wide range of applications.

2389 In Stock HPH1 Active - - - - - - - - -40°C ~ 105°C Through Hole - - - Board to Board - - Compare
  • CMR08F623GOCM
  • TSW-131-26-G-D
  • HPH1-B-10-UA