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首页 > Products >Capacitors >Mica and PTFE Capacitors >CDV30FJ751GO3F > CDV30FJ751GO3F Compare > CDV30FJ751GO3F 433613-06-0 TB200-09SP Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CDV30FJ751GO3F.PDF,
CDV30FJ751GO3F.docx,
CDV30FJ751GO3F.zip)

CDV30FJ751GO3F

CDV30FJ751GO3F 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TB200-09SP.PDF,
TB200-09SP.docx,
TB200-09SP.zip)

TB200-09SP

TB200-09SP 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(433613-06-0.PDF,
433613-06-0.docx,
433613-06-0.zip)

433613-06-0

433613-06-0 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
CDV30FJ751GO3F CDV30FJ751GO3F

(Alternative models available)

 Cornell Dubilier Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(CDV30FJ751GO3F.PDF,
CDV30FJ751GO3F.docx,
CDV30FJ751GO3F.zip)

1+: $17

10+: $16.83

100+: $16.66

500+: $16.49

1000+: $16.32

 Aerospace & defense
Grid infrastructure
Mobile phones

Products:电容器--云母和 PTFE 电容器

Manufacturers: Cornell Dubilier Electronics.
omoelec is one of the Distributors.
Wide range of applications.

128 In Stock CDV30 Active - - - - - - - - -55°C ~ 125°C Through Hole - - - - - - Compare
TB200-09SP TB200-09SP

(Alternative models available)

 Eaton Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(TB200-09SP.PDF,
TB200-09SP.docx,
TB200-09SP.zip)

1+: $10

10+: $9.9

100+: $9.8

500+: $9.7

1000+: $9.6

 PC & notebooks

Products:连接器，互连器件--端子块 - 隔板块

Manufacturers: Eaton.
omoelec is one of the Distributors.
Wide range of applications.

2698 In Stock Magnum® TB200 Active - - - - - - - - - - - - - - - - Compare
433613-06-0 433613-06-0

(Alternative models available)

 Curtis Industries Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(433613-06-0.PDF,
433613-06-0.docx,
433613-06-0.zip)

1+: $3

10+: $2.97

100+: $2.94

500+: $2.91

1000+: $2.88

 Wireless infrastructure

Products:连接器，互连器件--端子块 - 隔板块

Manufacturers: Curtis Industries.
omoelec is one of the Distributors.
Wide range of applications.

5992 In Stock 43000 Active - - - - - - - - - - - - - - - - Compare
  • CDV30FJ751GO3F
  • TB200-09SP
  • 433613-06-0