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首页 > Products >Discrete Semiconductor >Transistors - IGBTs - Modules >BSM300GA170DLS > BSM300GA170DLS Compare > BSM300GA170DLS T1230162512-000 T1920100125-000 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BSM300GA170DLS.PDF,
BSM300GA170DLS.docx,
BSM300GA170DLS.zip)

BSM300GA170DLS

BSM300GA170DLS 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T1920100125-000.PDF,
T1920100125-000.docx,
T1920100125-000.zip)

T1920100125-000

T1920100125-000 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T1230162512-000.PDF,
T1230162512-000.docx,
T1230162512-000.zip)

T1230162512-000

T1230162512-000 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
BSM300GA170DLS BSM300GA170DLS

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BSM300GA170DLS.PDF,
BSM300GA170DLS.docx,
BSM300GA170DLS.zip)

1+: $161

10+: $159.39

100+: $157.78

500+: $156.17

1000+: $154.56

 Appliances
Data center & enterprise computing
PC & notebooks

Products:分立半导体产品--晶体管 - IGBT - 模块

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1973 In Stock * Active - - - - - - - - - - - - - - - - Compare
T1920100125-000 T1920100125-000

(Alternative models available)

 TE Connectivity AMP Connectors Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T1920100125-000.PDF,
T1920100125-000.docx,
T1920100125-000.zip)

1+: $20

10+: $19.8

100+: $19.6

500+: $19.4

1000+: $19.2

 Industrial transport (non-car & non-light truck)
Tablets

Products:连接器，互连器件--重型连接器 - 外壳、盖罩、基底

Manufacturers: TE Connectivity AMP Connectors.
omoelec is one of the Distributors.
Wide range of applications.

4624 In Stock HBPR Active - - - - - - - - -40°C ~ 125°C - 5.748"" L x 2.283"" W x 3.976"" H (146.00mm x 58.00mm x 101.00mm) - - Top Entry - - Compare
T1230162512-000 T1230162512-000

(Alternative models available)

 TE Connectivity AMP Connectors Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T1230162512-000.PDF,
T1230162512-000.docx,
T1230162512-000.zip)

1+: $14

10+: $13.86

100+: $13.72

500+: $13.58

1000+: $13.44

 Enterprise projectors

Products:连接器，互连器件--重型连接器 - 外壳、盖罩、基底

Manufacturers: TE Connectivity AMP Connectors.
omoelec is one of the Distributors.
Wide range of applications.

1778 In Stock HB Active - - - - - - - - -40°C ~ 125°C - 3.681"" L x 1.693"" W x 2.992"" H (93.50mm x 43.00mm x 76.00mm) - - Side and Top Entry - - Compare
  • BSM300GA170DLS
  • T1920100125-000
  • T1230162512-000