Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
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BIC007F
(Alternative models available) |
Balluff |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(BIC007F.PDF, |
1+: $856 10+: $847.44 100+: $838.88 500+: $830.32 1000+: $821.76 |
Wireless infrastructure Power delivery |
Products:传感器,变送器--传感器,变送器放大器 |
Manufacturers: Balluff. |
Bag | 918 In Stock | - | Active | - | - | - | - | - | - | - | - | -5°C ~ 55°C | Panel Mount | - | - | - | - | - | - | Compare |
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54122-816442250LF
(Alternative models available) |
Storage & Server IO (Amphenol ICC) |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(54122-816442250LF.PDF, |
1+: $3 10+: $2.97 100+: $2.94 500+: $2.91 1000+: $2.88 |
Wireless infrastructure |
Products:连接器,互连器件--矩形连接器 - 板间隔柱,堆叠器(板对板) |
Manufacturers: Storage & Server IO (Amphenol ICC). |
Bag | 934 In Stock | BERGSTIK®, MezzSelect™, Basics+ | Active | - | - | - | - | - | - | - | - | - | Through Hole | - | - | - | - | - | - | Compare |
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HW-07-09-L-D-335-110
(Alternative models available) |
Samtec, Inc. |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(HW-07-09-L-D-335-110.PDF, |
1+: $1 10+: $0.99 100+: $0.98 500+: $0.97 1000+: $0.96 |
Lighting Test & measurement |
Products:连接器,互连器件--矩形连接器 - 板间隔柱,堆叠器(板对板) |
Manufacturers: Samtec, Inc.. |
1301 In Stock | Flex Stack, HW | Active | - | - | - | - | - | - | - | - | - | Through Hole | - | - | - | - | - | - | Compare |
- BIC007F
- 54122-816442250LF
- HW-07-09-L-D-335-110