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首页 > Products >Capacitors >Film Capacitors >B32022B3223K000 > B32022B3223K000 Compare > B32022B3223K000 10143740-008LF 5055701501 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32022B3223K000.PDF,
B32022B3223K000.docx,
B32022B3223K000.zip)

B32022B3223K000

B32022B3223K000 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(5055701501.PDF,
5055701501.docx,
5055701501.zip)

5055701501

5055701501 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(10143740-008LF.PDF,
10143740-008LF.docx,
10143740-008LF.zip)

10143740-008LF

10143740-008LF 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
B32022B3223K000 B32022B3223K000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32022B3223K000.PDF,
B32022B3223K000.docx,
B32022B3223K000.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Datacom module
Gaming

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

8145 In Stock B32022 Active - - - - - - - - -40°C ~ 110°C Through Hole 0.709"" L x 0.276"" W (18.00mm x 7.00mm) 0.492"" (12.50mm) - - - - Compare
5055701501 5055701501

(Alternative models available)

 Woodhead - Molex Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(5055701501.PDF,
5055701501.docx,
5055701501.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Wired networking
Test & measurement
Portable electronics

Products:连接器，互连器件--矩形连接器 - 外壳

Manufacturers: Woodhead - Molex.
omoelec is one of the Distributors.
Wide range of applications.

2314 In Stock Micro-Lock PLUS 505570 Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
10143740-008LF 10143740-008LF

(Alternative models available)

 Storage & Server IO (Amphenol ICC) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(10143740-008LF.PDF,
10143740-008LF.docx,
10143740-008LF.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 TV

Products:连接器，互连器件--矩形连接器 - 外壳

Manufacturers: Storage & Server IO (Amphenol ICC).
omoelec is one of the Distributors.
Wide range of applications.

2434 In Stock Minitek MicroSpace™ Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
  • B32022B3223K000
  • 5055701501
  • 10143740-008LF