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首页 > Products >Discrete Semiconductor >Transistors - IGBTs - Modules >APTGLQ30H65T3G > APTGLQ30H65T3G Compare > APTGLQ30H65T3G HVP.03.250.CLLPV PL75-55 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(APTGLQ30H65T3G.PDF,
APTGLQ30H65T3G.docx,
APTGLQ30H65T3G.zip)

APTGLQ30H65T3G

APTGLQ30H65T3G 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(PL75-55.PDF,
PL75-55.docx,
PL75-55.zip)

PL75-55

PL75-55 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HVP.03.250.CLLPV.PDF,
HVP.03.250.CLLPV.docx,
HVP.03.250.CLLPV.zip)

HVP.03.250.CLLPV

HVP.03.250.CLLPV 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
APTGLQ30H65T3G APTGLQ30H65T3G

(Alternative models available)

 Roving Networks / Microchip Technology Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(APTGLQ30H65T3G.PDF,
APTGLQ30H65T3G.docx,
APTGLQ30H65T3G.zip)

1+: $49

10+: $48.51

100+: $48.02

500+: $47.53

1000+: $47.04

 Enterprise machine

Products:分立半导体产品--晶体管 - IGBT - 模块

Manufacturers: Roving Networks / Microchip Technology.
omoelec is one of the Distributors.
Wide range of applications.

1022 In Stock - Active - - - - - - - - -40°C ~ 175°C (TJ) Chassis Mount - - - - - - Compare
PL75-55 PL75-55

(Alternative models available)

 Vitelec / Cinch Connectivity Solutions Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(PL75-55.PDF,
PL75-55.docx,
PL75-55.zip)

1+: $38

10+: $37.62

100+: $37.24

500+: $36.86

1000+: $36.48

 Aerospace & defense

Products:连接器，互连器件--同轴连接器（RF）组件

Manufacturers: Vitelec / Cinch Connectivity Solutions.
omoelec is one of the Distributors.
Wide range of applications.

8502 In Stock 70 Active - - - - - - - - - Free Hanging (In-Line) - - - - - - Compare
HVP.03.250.CLLPV HVP.03.250.CLLPV

(Alternative models available)

 REDEL / LEMO Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HVP.03.250.CLLPV.PDF,
HVP.03.250.CLLPV.docx,
HVP.03.250.CLLPV.zip)

1+: $25

10+: $24.75

100+: $24.5

500+: $24.25

1000+: $24

 Body electronics & lighting

Products:连接器，互连器件--同轴连接器（RF）组件

Manufacturers: REDEL / LEMO.
omoelec is one of the Distributors.
Wide range of applications.

1239 In Stock 03 Active - - - - - - - - - Panel Mount - - - - - - Compare
  • APTGLQ30H65T3G
  • PL75-55
  • HVP.03.250.CLLPV