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首页 > Products >Connectors, Interconnects >D-Sub, D-Shaped Connectors - Backshells, Hoods >AGP-09/IDC > AGP-09/IDC Compare > AGP-09/IDC 8LT011F99AB MS27468T17F35PAL Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(AGP-09/IDC.PDF,
AGP-09/IDC.docx,
AGP-09/IDC.zip)

AGP-09/IDC

AGP-09/IDC 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MS27468T17F35PAL.PDF,
MS27468T17F35PAL.docx,
MS27468T17F35PAL.zip)

MS27468T17F35PAL

MS27468T17F35PAL 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(8LT011F99AB.PDF,
8LT011F99AB.docx,
8LT011F99AB.zip)

8LT011F99AB

8LT011F99AB 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
AGP-09/IDC AGP-09/IDC

(Alternative models available)

 ASSMANN WSW Components Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(AGP-09/IDC.PDF,
AGP-09/IDC.docx,
AGP-09/IDC.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Advanced driver assistance systems (ADAS)
Test & measurement
Enterprise machine

Products:连接器，互连器件--D-Sub，D 形连接器 - 底壳，罩

Manufacturers: ASSMANN WSW Components.
omoelec is one of the Distributors.
Wide range of applications.

5829 In Stock - Active - - - - - - - - - - - - - - Two Piece Backshell - Compare
MS27468T17F35PAL MS27468T17F35PAL

(Alternative models available)

 Souriau-Sunbank by Eaton Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(MS27468T17F35PAL.PDF,
MS27468T17F35PAL.docx,
MS27468T17F35PAL.zip)

1+: $43

10+: $42.57

100+: $42.14

500+: $41.71

1000+: $41.28

 Infotainment & cluster
Test & measurement
PC & notebooks

Products:连接器，互连器件--圆形连接器 - 外壳

Manufacturers: Souriau-Sunbank by Eaton.
omoelec is one of the Distributors.
Wide range of applications.

230 In Stock Military, MIL-DTL-38999 Series I Active For Male Pins - - - - - - - - Panel Mount - - - - - - Compare
8LT011F99AB 8LT011F99AB

(Alternative models available)

 Souriau-Sunbank by Eaton Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(8LT011F99AB.PDF,
8LT011F99AB.docx,
8LT011F99AB.zip)

1+: $80

10+: $79.2

100+: $78.4

500+: $77.6

1000+: $76.8

 Body electronics & lighting

Products:连接器，互连器件--圆形连接器 - 外壳

Manufacturers: Souriau-Sunbank by Eaton.
omoelec is one of the Distributors.
Wide range of applications.

9428 In Stock * Active - - - - - - - - - - - - - - - - Compare
  • AGP-09/IDC
  • MS27468T17F35PAL
  • 8LT011F99AB