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首页 > Products >Connectors, Interconnects >Backplane Connectors - Housings >516-038-000-360 > 516-038-000-360 Compare > 516-038-000-360 HZS9C1LTA-E BZV55C16 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(516-038-000-360.PDF,
516-038-000-360.docx,
516-038-000-360.zip)

516-038-000-360

516-038-000-360 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BZV55C16.PDF,
BZV55C16.docx,
BZV55C16.zip)

BZV55C16

BZV55C16 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HZS9C1LTA-E.PDF,
HZS9C1LTA-E.docx,
HZS9C1LTA-E.zip)

HZS9C1LTA-E

HZS9C1LTA-E 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
516-038-000-360 516-038-000-360

(Alternative models available)

 EDAC Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(516-038-000-360.PDF,
516-038-000-360.docx,
516-038-000-360.zip)

1+: $25

10+: $24.75

100+: $24.5

500+: $24.25

1000+: $24

 Wireless infrastructure
Gaming

Products:连接器，互连器件--背板连接器 - 外壳

Manufacturers: EDAC Inc..
omoelec is one of the Distributors.
Wide range of applications.

398 In Stock 516 Active - - - - - - - - - Varies by Contact - - - - - - Compare
BZV55C16 BZV55C16

(Alternative models available)

 Microsemi Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BZV55C16.PDF,
BZV55C16.docx,
BZV55C16.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Wired networking
Data center & enterprise computing

Products:分立半导体产品--二极管 - 齐纳 - 单

Manufacturers: Microsemi.
omoelec is one of the Distributors.
Wide range of applications.

5280 In Stock - Active - - - - - - - - -65°C ~ 175°C Surface Mount - - - - - - Compare
HZS9C1LTA-E HZS9C1LTA-E

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HZS9C1LTA-E.PDF,
HZS9C1LTA-E.docx,
HZS9C1LTA-E.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Aerospace & defense
Mobile phones

Products:分立半导体产品--二极管 - 齐纳 - 单

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

6174 In Stock * Active - - - - - - - - - - - - - - - - Compare
  • 516-038-000-360
  • BZV55C16
  • HZS9C1LTA-E