Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
311P407-1P-B-12
(Alternative models available) |
VEAM |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(311P407-1P-B-12.PDF, |
1+: $98 10+: $97.02 100+: $96.04 500+: $95.06 1000+: $94.08 |
Power delivery |
Products:连接器,互连器件--D-Sub,D 形连接器 - 外壳 |
Manufacturers: VEAM. |
- | 9101 In Stock | D*MA | Active | - | - | - | - | - | - | - | - | - | Panel Mount | - | - | - | - | - | - | Compare | |
FN9266A-1-06
(Alternative models available) |
Schaffner EMC, Inc. |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(FN9266A-1-06.PDF, |
1+: $18 10+: $17.82 100+: $17.64 500+: $17.46 1000+: $17.28 |
Wired networking Power delivery |
Products:连接器,互连器件--电源接入连接器 - 输入口、输出口、模块 |
Manufacturers: Schaffner EMC, Inc.. |
Tray | 2736 In Stock | FN 9266 | Active | - | - | - | - | - | - | - | - | - | Panel Mount, Flange | - | - | - | - | - | - | Compare | |
5220.0123.1
(Alternative models available) |
Schurter |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(5220.0123.1.PDF, |
1+: $27 10+: $26.73 100+: $26.46 500+: $26.19 1000+: $25.92 |
Appliances Medical PC & notebooks |
Products:连接器,互连器件--电源接入连接器 - 输入口、输出口、模块 |
Manufacturers: Schurter. |
3393 In Stock | 5220 | Active | - | - | - | - | - | - | - | - | - | Panel Mount, Flange | - | - | - | - | - | - | Compare |
- 311P407-1P-B-12
- FN9266A-1-06
- 5220.0123.1