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首页 > Products >Integrated Circuits (ICs) >Embedded - Microprocessors >25EMPPC603EBG-100F > 25EMPPC603EBG-100F Compare > 25EMPPC603EBG-100F B32521N8223J000 B32653A2223J000 Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(25EMPPC603EBG-100F.PDF,
25EMPPC603EBG-100F.docx,
25EMPPC603EBG-100F.zip)

25EMPPC603EBG-100F

25EMPPC603EBG-100F 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32653A2223J000.PDF,
B32653A2223J000.docx,
B32653A2223J000.zip)

B32653A2223J000

B32653A2223J000 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32521N8223J000.PDF,
B32521N8223J000.docx,
B32521N8223J000.zip)

B32521N8223J000

B32521N8223J000 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
25EMPPC603EBG-100F 25EMPPC603EBG-100F

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(25EMPPC603EBG-100F.PDF,
25EMPPC603EBG-100F.docx,
25EMPPC603EBG-100F.zip)

1+: $26

10+: $25.74

100+: $25.48

500+: $25.22

1000+: $24.96

 Power delivery
Test & measurement
Factory automation & control

Products:集成电路（IC）--嵌入式 - 微处理器

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

5455 In Stock * Active - - - - - - - - - - - - - - - - Compare
B32653A2223J000 B32653A2223J000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32653A2223J000.PDF,
B32653A2223J000.docx,
B32653A2223J000.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Aerospace & defense
Data storage

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

5805 In Stock B32653 Active - - - - - - - - -55°C ~ 100°C Through Hole 1.043"" L x 0.571"" W (26.50mm x 14.50mm) 1.161"" (29.50mm) - - - - Compare
B32521N8223J000 B32521N8223J000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32521N8223J000.PDF,
B32521N8223J000.docx,
B32521N8223J000.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Broadband fixed line access
Medical
Connected peripherals & printers

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

1781 In Stock B32521 Active - - - - - - - - -55°C ~ 125°C Through Hole 0.512"" L x 0.197"" W (13.00mm x 5.00mm) 0.433"" (11.00mm) - - - - Compare
  • 25EMPPC603EBG-100F
  • B32653A2223J000
  • B32521N8223J000