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首页 > Products >Connectors, Interconnects >Backplane Connectors - Specialized >2102771-1 > 2102771-1 Compare > 2102771-1 BCM6123E60E15A3T01 EVB-EZ6303QI Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2102771-1.PDF,
2102771-1.docx,
2102771-1.zip)

2102771-1

2102771-1 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EVB-EZ6303QI.PDF,
EVB-EZ6303QI.docx,
EVB-EZ6303QI.zip)

EVB-EZ6303QI

EVB-EZ6303QI 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BCM6123E60E15A3T01.PDF,
BCM6123E60E15A3T01.docx,
BCM6123E60E15A3T01.zip)

BCM6123E60E15A3T01

BCM6123E60E15A3T01 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
2102771-1 2102771-1

(Alternative models available)

 TE Connectivity Aerospace Defense and Marine Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(2102771-1.PDF,
2102771-1.docx,
2102771-1.zip)

1+: $100

10+: $99

100+: $98

500+: $97

1000+: $96

 Hybrid, electric & powertrain systems
Building automation

Products:连接器，互连器件--背板连接器 - 专用

Manufacturers: TE Connectivity Aerospace Defense and Marine.
omoelec is one of the Distributors.
Wide range of applications.

6872 In Stock MultiGig RT2-R Active - - - - - - - - - Board Edge, Through Hole, Right Angle - - - - - - Compare
EVB-EZ6303QI EVB-EZ6303QI

(Alternative models available)

 Altera (Intel) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(EVB-EZ6303QI.PDF,
EVB-EZ6303QI.docx,
EVB-EZ6303QI.zip)

1+: $69

10+: $68.31

100+: $67.62

500+: $66.93

1000+: $66.24

 Mobile phones

Products:开发板，套件，编程器--评估板 - DC/DC & AC/DC（离线）SMPS

Manufacturers: Altera (Intel).
omoelec is one of the Distributors.
Wide range of applications.

5625 In Stock Enpirion® - - - - - - - - - - - - - - - - - Compare
BCM6123E60E15A3T01 BCM6123E60E15A3T01

(Alternative models available)

 Vicor Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BCM6123E60E15A3T01.PDF,
BCM6123E60E15A3T01.docx,
BCM6123E60E15A3T01.zip)

1+: $1063

10+: $1052.37

100+: $1041.74

500+: $1031.11

1000+: $1020.48

 Infotainment & cluster

Products:开发板，套件，编程器--评估板 - DC/DC & AC/DC（离线）SMPS

Manufacturers: Vicor.
omoelec is one of the Distributors.
Wide range of applications.

4346 In Stock VI Chip® BCM® - - - - - - - - - - - - - - - - - Compare
  • 2102771-1
  • EVB-EZ6303QI
  • BCM6123E60E15A3T01