Image | Part Number | Manufacturer | Datasheet | Pricing(USD) | Applications | Products Category | Remark | Package | Qty | Series | Part Status | Type | Intended Chipset | Chipset Manufacturer | Voltage - Primary | Voltage - Auxiliary | Voltage - Isolation | Inductance @ Frequency | Frequency | Operating Temperature | Mounting Type | Size / Dimension | Height - Seated (Max) | Footprint | Style | Accessory Type | For Use With/Related Products | Compare |
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2002182000
(Alternative models available) |
Woodhead - Molex |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(2002182000.PDF, |
1+: $540 10+: $534.6 100+: $529.2 500+: $523.8 1000+: $518.4 |
Wireless infrastructure Test & measurement |
Products:工具--压接器,压接机,压力机 |
Manufacturers: Woodhead - Molex. |
3046 In Stock | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Rectangular Contacts | Compare | |
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084-0832-07
(Alternative models available) |
TE Connectivity DEUTSCH Connectors |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(084-0832-07.PDF, |
1+: $701 10+: $693.99 100+: $686.98 500+: $679.97 1000+: $672.96 |
Datacom module Grid infrastructure Enterprise machine |
Products:连接器,互连器件--圆形连接器 - 配件 |
Manufacturers: TE Connectivity DEUTSCH Connectors. |
8965 In Stock | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compare | |
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FGG.XB.130.LC
(Alternative models available) |
REDEL / LEMO |
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.
(FGG.XB.130.LC.PDF, |
1+: $8 10+: $7.92 100+: $7.84 500+: $7.76 1000+: $7.68 |
Mobile phones |
Products:连接器,互连器件--圆形连接器 - 配件 |
Manufacturers: REDEL / LEMO. |
Bag | 5729 In Stock | XB | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Collet, Back-Nut | XB Series Connector | Compare |
- 2002182000
- 084-0832-07
- FGG.XB.130.LC