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首页 > Products >Integrated Circuits (ICs) >Embedded - Microcontroller, Microprocessor, FPGA M >20-101-1329 > 20-101-1329 Compare > 20-101-1329 B32676E6405K000 ECW-HC3F562JQ Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(20-101-1329.PDF,
20-101-1329.docx,
20-101-1329.zip)

20-101-1329

20-101-1329 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(ECW-HC3F562JQ.PDF,
ECW-HC3F562JQ.docx,
ECW-HC3F562JQ.zip)

ECW-HC3F562JQ

ECW-HC3F562JQ 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32676E6405K000.PDF,
B32676E6405K000.docx,
B32676E6405K000.zip)

B32676E6405K000

B32676E6405K000 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
20-101-1329 20-101-1329

(Alternative models available)

 Digi Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(20-101-1329.PDF,
20-101-1329.docx,
20-101-1329.zip)

1+: $63

10+: $62.37

100+: $61.74

500+: $61.11

1000+: $60.48

 Wired networking
Data center & enterprise computing

Products:集成电路（IC）--嵌入式 - 微控制器，微处理器，FPGA 模块

Manufacturers: Digi.
omoelec is one of the Distributors.
Wide range of applications.

358 In Stock RabbitCore RCM3700 Not For New Designs - - - - - - - - -40°C ~ 70°C - 1.2"" x 2.95"" (30mm x 75mm) - - - - - Compare
ECW-HC3F562JQ ECW-HC3F562JQ

(Alternative models available)

 Panasonic Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(ECW-HC3F562JQ.PDF,
ECW-HC3F562JQ.docx,
ECW-HC3F562JQ.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Appliances
Test & measurement
Mobile phones

Products:电容器--薄膜电容器

Manufacturers: Panasonic.
omoelec is one of the Distributors.
Wide range of applications.

3025 In Stock ECW-H(C) Active - - - - - - - - -40°C ~ 105°C Through Hole 1.016"" L x 0.283"" W (25.80mm x 7.20mm) 0.748"" (19.00mm) - - - - Compare
B32676E6405K000 B32676E6405K000

(Alternative models available)

 TDK EPCOS Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(B32676E6405K000.PDF,
B32676E6405K000.docx,
B32676E6405K000.zip)

1+: $4

10+: $3.96

100+: $3.92

500+: $3.88

1000+: $3.84

 Data center & enterprise computing

Products:电容器--薄膜电容器

Manufacturers: TDK EPCOS.
omoelec is one of the Distributors.
Wide range of applications.

5945 In Stock B32676 Active - - - - - - - - -40°C ~ 105°C Through Hole 1.654"" L x 0.630"" W (42.00mm x 16.00mm) 1.122"" (28.50mm) - - - - Compare
  • 20-101-1329
  • ECW-HC3F562JQ
  • B32676E6405K000