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首页 > Products >Integrated Circuits (ICs) >Embedded - System On Chip (SoC) >1SX250LH3F55E3VG > 1SX250LH3F55E3VG Compare > 1SX250LH3F55E3VG R76UI22705050J BFC233866183 Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1SX250LH3F55E3VG.PDF,
1SX250LH3F55E3VG.docx,
1SX250LH3F55E3VG.zip)

1SX250LH3F55E3VG

1SX250LH3F55E3VG 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BFC233866183.PDF,
BFC233866183.docx,
BFC233866183.zip)

BFC233866183

BFC233866183 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(R76UI22705050J.PDF,
R76UI22705050J.docx,
R76UI22705050J.zip)

R76UI22705050J

R76UI22705050J 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
1SX250LH3F55E3VG 1SX250LH3F55E3VG

(Alternative models available)

 Altera (Intel) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1SX250LH3F55E3VG.PDF,
1SX250LH3F55E3VG.docx,
1SX250LH3F55E3VG.zip)

1+: $15846

10+: $15687.54

100+: $15529.08

500+: $15370.62

1000+: $15212.16

 Data center & enterprise computing
Wired networking

Products:集成电路（IC）--嵌入式 - 片上系统（SoC）

Manufacturers: Altera (Intel).
omoelec is one of the Distributors.
Wide range of applications.

Tray 9642 In Stock Stratix® 10 SX Active - - - - - - - - 0°C ~ 100°C (TJ) - - - - - - - Compare
BFC233866183 BFC233866183

(Alternative models available)

 Vishay BC Components/Beyshlag/Draloric Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(BFC233866183.PDF,
BFC233866183.docx,
BFC233866183.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Building automation
Grid infrastructure
Enterprise projectors

Products:电容器--薄膜电容器

Manufacturers: Vishay BC Components/Beyshlag/Draloric.
omoelec is one of the Distributors.
Wide range of applications.

2313 In Stock MKP338 6 Active - - - - - - - - -55°C ~ 105°C Through Hole 0.689"" L x 0.236"" W (17.50mm x 6.00mm) 0.551"" (14.00mm) - - - - Compare
R76UI22705050J R76UI22705050J

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(R76UI22705050J.PDF,
R76UI22705050J.docx,
R76UI22705050J.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Grid infrastructure

Products:电容器--薄膜电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

2148 In Stock R76 Active - - - - - - - - -55°C ~ 110°C Through Hole 0.709"" L x 0.433"" W (18.00mm x 11.00mm) 0.752"" (19.10mm) - - - - Compare
  • 1SX250LH3F55E3VG
  • BFC233866183
  • R76UI22705050J