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首页 > Products >Integrated Circuits (ICs) >Embedded - System On Chip (SoC) >1SX250HU3F50E1VG > 1SX250HU3F50E1VG Compare > 1SX250HU3F50E1VG 150D107X9025S2BE3 T356F476K006AS Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1SX250HU3F50E1VG.PDF,
1SX250HU3F50E1VG.docx,
1SX250HU3F50E1VG.zip)

1SX250HU3F50E1VG

1SX250HU3F50E1VG 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T356F476K006AS.PDF,
T356F476K006AS.docx,
T356F476K006AS.zip)

T356F476K006AS

T356F476K006AS 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(150D107X9025S2BE3.PDF,
150D107X9025S2BE3.docx,
150D107X9025S2BE3.zip)

150D107X9025S2BE3

150D107X9025S2BE3 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
1SX250HU3F50E1VG 1SX250HU3F50E1VG

(Alternative models available)

 Altera (Intel) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1SX250HU3F50E1VG.PDF,
1SX250HU3F50E1VG.docx,
1SX250HU3F50E1VG.zip)

1+: $27864

10+: $27585.36

100+: $27306.72

500+: $27028.08

1000+: $26749.44

 Wireless infrastructure
Data storage

Products:集成电路（IC）--嵌入式 - 片上系统（SoC）

Manufacturers: Altera (Intel).
omoelec is one of the Distributors.
Wide range of applications.

Tray 2607 In Stock Stratix® 10 SX Active - - - - - - - - 0°C ~ 100°C (TJ) - - - - - - - Compare
T356F476K006AS T356F476K006AS

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T356F476K006AS.PDF,
T356F476K006AS.docx,
T356F476K006AS.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Datacom module
Data storage

Products:电容器--钽电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

975 In Stock T356, UltraDip II Active Conformal Coated - - - - - - - -55°C ~ 125°C Through Hole 0.236"" Dia (6.00mm) 0.441"" (11.20mm) - - - - Compare
150D107X9025S2BE3 150D107X9025S2BE3

(Alternative models available)

 Vishay / Sprague Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(150D107X9025S2BE3.PDF,
150D107X9025S2BE3.docx,
150D107X9025S2BE3.zip)

1+: $12

10+: $11.88

100+: $11.76

500+: $11.64

1000+: $11.52

 Broadband fixed line access
Test & measurement

Products:电容器--钽电容器

Manufacturers: Vishay / Sprague.
omoelec is one of the Distributors.
Wide range of applications.

6538 In Stock TANTALEX®, 150D Active Hermetically Sealed - - - - - - - -55°C ~ 125°C Through Hole 0.351"" Dia x 0.786"" L (8.92mm x 19.96mm) - - - - - Compare
  • 1SX250HU3F50E1VG
  • T356F476K006AS
  • 150D107X9025S2BE3