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首页 > Products >Integrated Circuits (ICs) >Embedded - FPGAs (Field Programmable Gate Array) >1SG210HN3F43E3VG > 1SG210HN3F43E3VG Compare > 1SG210HN3F43E3VG T322B475K015AS 199D227X0010F6V1E3 Compare
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1SG210HN3F43E3VG.PDF,
1SG210HN3F43E3VG.docx,
1SG210HN3F43E3VG.zip)

1SG210HN3F43E3VG

1SG210HN3F43E3VG 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(199D227X0010F6V1E3.PDF,
199D227X0010F6V1E3.docx,
199D227X0010F6V1E3.zip)

199D227X0010F6V1E3

199D227X0010F6V1E3 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T322B475K015AS.PDF,
T322B475K015AS.docx,
T322B475K015AS.zip)

T322B475K015AS

T322B475K015AS 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
1SG210HN3F43E3VG 1SG210HN3F43E3VG

(Alternative models available)

 Altera (Intel) Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(1SG210HN3F43E3VG.PDF,
1SG210HN3F43E3VG.docx,
1SG210HN3F43E3VG.zip)

1+: $14592

10+: $14446.08

100+: $14300.16

500+: $14154.24

1000+: $14008.32

 Grid infrastructure
Wearables (non-medical)

Products:集成电路（IC）--嵌入式 - FPGA（现场可编程门阵列）

Manufacturers: Altera (Intel).
omoelec is one of the Distributors.
Wide range of applications.

Tray 7377 In Stock Stratix® 10 GX Active - - - - - - - - 0°C ~ 100°C (TJ) Surface Mount - - - - - - Compare
199D227X0010F6V1E3 199D227X0010F6V1E3

(Alternative models available)

 Vishay / Sprague Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(199D227X0010F6V1E3.PDF,
199D227X0010F6V1E3.docx,
199D227X0010F6V1E3.zip)

1+: $7

10+: $6.93

100+: $6.86

500+: $6.79

1000+: $6.72

 Wireless infrastructure

Products:电容器--钽电容器

Manufacturers: Vishay / Sprague.
omoelec is one of the Distributors.
Wide range of applications.

6128 In Stock TANTALEX®, 199D Active Conformal Coated - - - - - - - -55°C ~ 125°C Through Hole 0.378"" Dia (9.60mm) 0.748"" (19.00mm) - - - - Compare
T322B475K015AS T322B475K015AS

(Alternative models available)

 KEMET Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(T322B475K015AS.PDF,
T322B475K015AS.docx,
T322B475K015AS.zip)

1+: $1

10+: $0.99

100+: $0.98

500+: $0.97

1000+: $0.96

 Wireless infrastructure
Enterprise machine

Products:电容器--钽电容器

Manufacturers: KEMET.
omoelec is one of the Distributors.
Wide range of applications.

820 In Stock T322 Active Molded - - - - - - - -55°C ~ 125°C Through Hole 0.110"" Dia x 0.290"" L (2.79mm x 7.37mm) - - - - - Compare
  • 1SG210HN3F43E3VG
  • 199D227X0010F6V1E3
  • T322B475K015AS