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首页 > Products >Connectors, Interconnects >Backplane Connectors - Contacts >103-007-253-100 > 103-007-253-100 Compare > 103-007-253-100 SPA20N65C3XKSA1 HUF76129S3ST Compare
Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(103-007-253-100.PDF,
103-007-253-100.docx,
103-007-253-100.zip)

103-007-253-100

103-007-253-100 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HUF76129S3ST.PDF,
HUF76129S3ST.docx,
HUF76129S3ST.zip)

HUF76129S3ST

HUF76129S3ST 

Bulk refers to a package (usually a bag) of loose unorganized parts, and is usually unsuitable for automated assembly machines. Bulk parts are packaged according to the ESD (ElectroStatic Discharge) and MSL (Moisture Sensitivity Level) protection requirements determined by the manufacturer.
Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(SPA20N65C3XKSA1.PDF,
SPA20N65C3XKSA1.docx,
SPA20N65C3XKSA1.zip)

SPA20N65C3XKSA1

SPA20N65C3XKSA1 

Image Part Number Manufacturer Datasheet Pricing(USD) Applications Products Category Remark Package Qty Series Part Status Type Intended Chipset Chipset Manufacturer Voltage - Primary Voltage - Auxiliary Voltage - Isolation Inductance @ Frequency Frequency Operating Temperature Mounting Type Size / Dimension Height - Seated (Max) Footprint Style Accessory Type For Use With/Related Products Compare
103-007-253-100 103-007-253-100

(Alternative models available)

 EDAC Inc. Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(103-007-253-100.PDF,
103-007-253-100.docx,
103-007-253-100.zip)

1+: $4

10+: $3.96

100+: $3.92

500+: $3.88

1000+: $3.84

 Grid infrastructure
Connected peripherals & printers

Products:连接器，互连器件--背板连接器 - 触点

Manufacturers: EDAC Inc..
omoelec is one of the Distributors.
Wide range of applications.

4693 In Stock 103 Active Signal - - - - - - - - - - - - - - - Compare
HUF76129S3ST HUF76129S3ST

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(HUF76129S3ST.PDF,
HUF76129S3ST.docx,
HUF76129S3ST.zip)

1+: $0

10+: $0

100+: $0

500+: $0

1000+: $0

 Tablets

Products:分立半导体产品--晶体管 - FET, MOSFET - 单个

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

3868 In Stock * Active - - - - - - - - - - - - - - - - Compare
SPA20N65C3XKSA1 SPA20N65C3XKSA1

(Alternative models available)

 Rochester Electronics Datasheet is the technical data form of the product, which generally exists in PDF format or docx format.

(SPA20N65C3XKSA1.PDF,
SPA20N65C3XKSA1.docx,
SPA20N65C3XKSA1.zip)

1+: $2

10+: $1.98

100+: $1.96

500+: $1.94

1000+: $1.92

 Wired networking
Pro audio, video & signage

Products:分立半导体产品--晶体管 - FET, MOSFET - 单个

Manufacturers: Rochester Electronics.
omoelec is one of the Distributors.
Wide range of applications.

1614 In Stock CoolMOS™ Active - - - - - - - - -55°C ~ 150°C (TJ) Through Hole - - - - - - Compare
  • 103-007-253-100
  • HUF76129S3ST
  • SPA20N65C3XKSA1